Oregon Chapter Tutorial: How Clean is Clean and How Do You Know for Sure?
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Date: |
Wed, April 21, 2021 |
Admission: |
paid |
Description: |
You are invited to attend this half-day course addressing critical issues of electronics manufacturing.
How Clean is Clean and How Do You Know for Sure?
Pricing:
About this Course: This course is based on IPC J-STD-001H Cleanliness Guidelines that require the manufacturer qualifies (N1D2D3) the soldering and/or the cleaning process that results in acceptable levels of flux and other residues. Objective evidence shall (N1D2D3) be available for review. The end product is a Qualified Manufacturing Process (QMP). Today’s electronic hardware require miniaturized components that are leadless and bottom terminated. These complex assemblies incorporate numerous variables that impact the qualify and reliability of the manufactured assemblies in the end use environment. Of concern are the kinds of residues remaining on the electronic assembly and the effects that these residues have on the electro-chemical reliability of the end-product. Numerous materials are involved to build printed wiring boards and components. The top and bottom-side electrical modules and sub-assemblies must function on demand. Whether building to a No-Clean or Cleaning Process, characterization of materials is a critical step. Secondary soldering steps need to be included. There is a lot involved when considering the electro-chemical reliability of your electronics. Leadless and Bottom Terminated Components have a very low standoff gap. Blocked outgassing channels can result in active flux residues. The selection of your soldering materials is a key factor. Characterizing these materials to determine the benign nature for a No-clean process and cleanability for a Cleaning process is critical. The reflow conditions must also be understood. On multiple layered boards, heat transfer under the component termination impacts the ionic nature of the flux residue. If you are building to a no-clean standard, you must consider the cleanliness of incoming boards and components, multiple soldering steps including top and bottom surface mount, wave or selective soldering, rework and repair. If you are cleaning, qualifying the cleaning process and cleaning machine across the entire assembly with minimal variation over the life of the cleaning agent is critical. During assembly, the residue condition on the manufactured product can change. This course will examine cleanliness and humidity effects of the process residue on the reliability of the printed wiring assembly. The course will discuss flux types and considerations. Cleaning agent designs and matching the cleaning machine and process will also be presented. Understanding these conditions and their potential impact on electronic performance will help answer the question “How Clean is Clean?” How You Will Benefit After completing this course you will be able to:
Topics Covered
Who Should Attend
Bios: Dr. Michael Bixenman, Chief Technology Officer (CTO) and co-founder of KYZEN Corp. and Magnalytix, LLC, has over 30 years of experience in the design of electronic assembly cleaning materials and process integration. Sharing his research, knowledge, and expertise is Mike’s passion as he is the author and co-author of over 100 technical papers and presentations presented all over the world. He believes in the power of collaboration by working with others to solve problems quickly. An active member of several industry associations, he has chaired and led many committees, symposiums, and task groups that are committed to understanding the cleaning and reliability challenges of today’s ever-changing electronics industry. Dr. Bixenman holds four earned degrees, including a Doctorate in Business Administration (DBA). Mark McMeen is Vice President of Engineering and Manufacturing for STI Electronics and Magnalytix and was also one of the Co-Founders of Magnalytix. He currently oversees the day-to-day operations of the Engineering / Manufacturing Services division of STI and Magnalytix which incorporates three entities: Analytical lab, Prototype and Manufacturing Lab and Microelectronics Lab. He has over 28 years of experience in the manufacturing and engineering of printed circuit boards, both flexible and rigid, as well as in the manufacture of electronic assemblies. He has spent most of his career to date in the manufacturing of high density and high reliability printed circuit board assemblies and multi-chip modules and their integration onto printed circuit boards. He currently holds two patents in the fabrication of flexible circuit boards and the processes necessary to imbed integrated circuits inside rigid printed circuit boards. |
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