Electronics in Harsh Environments Conference - Free Pre-Conference Webinar

The Electronics in Harsh Environments Conference, 24-26 April in Amsterdam, Netherlands, will focus on building reliable electronics used in power electronics and harsh environments. In advance of this event we are holding a webinar to give engineers a preview of the topics and presentation content you can expect to see at the conference.

Thermal, power and signal integrity requirements can present challenges when on devices that operate within harsh environments. Component integration, paired with a growing complexity of the package architectures, larger form factors and higher interconnection densities increase the risk of in-field failures. Over powering or over heating of a device can have serious consequences including internal package failure, down-stream device errors and second level interconnect solder joint failures. Soldering residues are more problematic, and if not understood, can result in both intermittent and complete device failure.

This conference tackles the challenges and best practices for building reliable electronic devices that will perform to design standards when used in harsh environments. Specific topics include building reliable high density assemblies, power electronics, electric hybrids, product assembly challenges, cleaning, coating, process control, and monitoring and tracking production hardware. Challenging areas such as high temperature soldering, solder material advances, and new standards will be presented.

The webinar will run for approximately 60min with question and answer session. Space is limited to the first 100 delegates/companies so reserve your place now! A copy of each of the slides presented will be provided after the webinar.