PCB & Ceramic Cap strain - Specification?

There's no such specification. Not should there be. Shear tests [in our opinion] are senseless, because: * Solder joint strength in pull/shear varies with lead geometry, solder volume, lead metal/metallization, and the way the test is done. * Shear stress you measure depends more on the shear rate and on the point where the force is applied than on the grain structure. * When shearing a component, you not only apply shear stress, but also roll the component over. This means that shear stress and normal stress are present, again making the results very dependent on where you apply the load.

Thus, in our opinion, best case, these tests are relative measurements. So, only results with the same measurement parameters can be compared. Additionally, we believe that the variations in the geometry of solder joints and of the measurement itself contribute at least to the same variation in the measurement results as voids, unless your solder joints are reminiscent of Swiss cheese or very poorly wetted.

We think, the best you can do is micro sections in regular intervals and keeping your process under control. If solder joints are metallurgically OK there is no point to concern about their strength

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