Glued component location accuracy after reflow

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Hi, i'm looking to optimise post-reflow component location a... - Jul 28, 2023 by SimonR

Hi SimionR, Is Glue Process Dispencing or Glue Printing thr... - Jul 28, 2023 by shrikant_borkar

Hi Simon, Yes, red glue should help, assuming that it is be... - Jul 31, 2023 by MagyarT

Chip-bonder glue(Loctite 3612 for example) will harden at lo... - Jul 31, 2023 by Evtimov

@srikant I'll check their process, meanwhile thanks for the ... - Aug 01, 2023 by SimonR

you are welcome, don't forget to set the search window (Fid... - Aug 01, 2023 by shrikant_borkar

SimonR

#89785

Glued component location accuracy after reflow | 28 July, 2023

Hi, i'm looking to optimise post-reflow component location accuracy. Would red glue help with this? I'm hoping the glue will hold the component in place during reflow, and we'll end up somewhere around the 35um (3 sigma) placement accuracy of the pick place machine. Is this how it works? It's for 0805 components.

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shrikant_borkar

#89786

Glued component location accuracy after reflow | 28 July, 2023

Hi SimionR, Is Glue Process Dispencing or Glue Printing thru Stencil? if Its Dispencing Glue thru a Nozzle then its a controllable process. I have performed it thru HDP-3 Panasonic. Placement of Glue either one DOT or Process must be aligned with the PAD center. Next Stage Placement Chip-shooter All locations Placement should ne be Placed in the center of Glue Dots. Fiducial Mark if 1D. then the search Window is set to 3D. Reflow Parameter at per Glue Specification and must get Qualified for Pullforce test or Twist Torque test.All the best reply here with your action

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MagyarT

#89792

Glued component location accuracy after reflow | 31 July, 2023

Hi Simon,

Yes, red glue should help, assuming that it is being dispensed by a glue dispenser. For stencil printing I used yellow glue in the past (can't remember the brand).

Your pick and place machine should be able to achieve on it's own 35 um placement accuracy before you glue these components. The glue will only help by keeping the components in place so the reflow is not pulling the components away, as the glue cures earlier (around at 125 degrees in 4 minutes or at 150 degrees in 1 minute) than the solder paste melts (at around 220 degrees +-). Please keep this in mind.

Should there be more specific questions, let us know here on the forum.

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Evtimov

#89799

Glued component location accuracy after reflow | 31 July, 2023

Chip-bonder glue(Loctite 3612 for example) will harden at lower temperature way before paste goes to liquidus stage, so it will hold the part in place.

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SimonR

#89802

Glued component location accuracy after reflow | 1 August, 2023

@srikant I'll check their process, meanwhile thanks for the reminder to put fiducials nearby.

@MagyarT and Evtimov it sounds like it should work OK, the machine specs are 35um (3 sigma) so the results will be interesting, will post when I get some data, thanks.

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shrikant_borkar

#89803

Glued component location accuracy after reflow | 1 August, 2023

you are welcome, don't forget to set the search window (Fiducial Mark if 1D. then the search Window is set to 3D). Please reply once you have done.

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