Printed Circuit Board Assembly & PCB Design SMT Electronics Assembly Manufacturing Forum

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Solder Pastes Inspection parameters

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#88871

Solder Pastes Inspection parameters | 20 January, 2023

We have a PARMI SigmaX SPI (Solder Paste Inspection) machine, right now I'm trying to understand about parameters of the machine. I know minimus, Maximus, and warning values need to be defined. Height value understands that can be defined by the thickness of the stencil. Volume with the stencil thickness times the aperture size (what's the formula to do this)? We've been having a lot of trouble with missing solder paste, so I want to understand a little bit more about how I can define the parameters, and how can i close the minimum and maximum to ensure solder paste it is being well applied without any insufficient solder paste.

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Djo

#89981

Solder Pastes Inspection parameters | 19 September, 2023

Hello Luis ,

see the attached photo ( and it is applicable for stencils 100µm thick )

Attachments:

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#89990

Solder Pastes Inspection parameters | 22 September, 2023

Hi there,

if there is insufficient Volume you may optimize the design of your stencil. Its not the goal to decrease the tolerances. Take the PCB and take a look at the printing Shapes with microscope or use the zoom in 3D Function. If there is too less solder u can see immediately.

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