Automatic Solder Dispensing

Ello. I'm a fresh grad that just entered an SMT assembly company as a process engineer.

My first task is to assist in automating the soldering process - let the machine dispense solder paste automatically so operators do not need to do it by hand.

Previously, the company used canister type solder packaging on the Panasonic SPG & SPG2 with the 'Holed Pot Type Automatic Solder Supply' option (ref: https://mediac-pfse.panasonic.eu/p/2021-03/SPG2_en_20_0101.pdf?VersionId=9vW1tGPK86hEaSo6s79Kw1UeEiAnGW68)

Currently we changed to tube type packaging due to a client request, and the corresponding automatic dispenser was installed as well. However, due to a design error the sensors for remaining solder on the printer surface cannot be used in conjunction with larger squeegees. (Looking at you, Panasonic) And as a result, we have to manually define the period for auto-dispensing (basically dispense after a certain count of prints) and for that to be truly automated, a whole bunch of variables need to be clarified, bringing us to my current problem.

What is the trend for the variation in amount dispensed across repetitions, and is there a way to decrease it on the SPG2?

To explain it simply, a full tube can be dispensed through several repetitions before it is fully used up. I had initially expected that each repetition dispenses the same amount albeit with some deviations. The reality is the amount dispensed gradually decreases as the contents of the tube decreases.

Now when we have to manually calculate the count before each repetition, we also have to take into account the varying amounts being dispensed. If the amount dispensed cannot be controlled, can we at least programme the counts to be varied with respect to the number of repetitions performed?

Any input would be greatly appreciated and treasured. My sincerest gratitudes.

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