Printed Circuit Board Assembly & PCB Design SMT Electronics Assembly Manufacturing Forum

Printed Circuit Board Assembly & PCB Design Forum

SMT electronics assembly manufacturing forum.


depanelizing with C02 Laser

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#88672

depanelizing with C02 Laser | 30 November, 2022

I have done some initial testing and looks like a 60W C02 laser can be used effectively for depanelizing boards. Charing initially is significant but by reducing power and making multiple passes AND flooding with Nitrogen I expect this an be reduced to a manageable level. Thin boards are easy <.032 to simply cut, 062 boards with mouse bites take a few passes, and V scored can be weakened so they break out very easily with little stress to the board. Has anyone else used or worked with similar lasers in this regard? My initial testing and leaning to purchase is an Epilog 60W C02 or similar, but NOT a Chinese knock off.

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#88673

depanelizing with C02 Laser | 30 November, 2022

And new not used? It sounds like something I would not want to buy used.

What the time like with multiple passes?

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#88692

depanelizing with C02 Laser | 7 December, 2022

cut time was very good (not a concern) Main advantage is flexibility and simpler fixturing than routing as there are no side forces. Charing was evident, but can be reduced with a few tweaks.

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