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Stencil Design for BGA with 0.2 mm Diameter Pad and 0.4 mm pitch

Views: 1384

I am optimizing a stencil opening for BGA with 0.4mm pitch a... - Nov 12, 2019 by myke_SMT  

Maybe something like this could work? ... - Nov 14, 2019 by Jandon  

Hi Jandon, Thanks, I will try it on my DOE. ... - Nov 14, 2019 by myke_SMT  

Yes, 0.25x0.25 square could work @0.1 thickness, use nano-co... - Nov 14, 2019 by sssamw  

Use a type 5 solder for maximum paste release. ... - Nov 14, 2019 by dman97  


myke_SMT

#83730

Stencil Design for BGA with 0.2 mm Diameter Pad and 0.4 mm pitch | 12 November, 2019

I am optimizing a stencil opening for BGA with 0.4mm pitch and pad diameter of 0.2mm. Can anyone advice of stencil thickness and stencil opening I can use in order to have a good paste release. Thanks for all your answers.

reply »


Jandon

#83749

Stencil Design for BGA with 0.2 mm Diameter Pad and 0.4 mm pitch | 14 November, 2019

Maybe something like this could work?

Attachments:

reply »


myke_SMT

#83756

Stencil Design for BGA with 0.2 mm Diameter Pad and 0.4 mm pitch | 14 November, 2019

Hi Jandon,

Thanks, I will try it on my DOE.

reply »


sssamw

#83758

Stencil Design for BGA with 0.2 mm Diameter Pad and 0.4 mm pitch | 14 November, 2019

Yes, 0.25x0.25 square could work @0.1 thickness, use nano-coating or electroform stencil for better solder paste release.

reply »


dman97

#83762

Stencil Design for BGA with 0.2 mm Diameter Pad and 0.4 mm pitch | 14 November, 2019

Use a type 5 solder for maximum paste release.

reply »

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