Hello,
Have you had a look into our Focused IR Rework systems? A popular alternative to the convectional Rework systems. Our IR-E3M (Micro) would be perfect for your applciation and on one machine you will have the capability of Reworking BGAs up to 70mm and all the way down to 0201s. When it comes to profiling here is a question we recieved from one of our customers.
“I was wondering about thermal profiles. How long does each one take to make and save on the system? Also, what has been your experience from businesses moving away from hot air rework stations to the IR, as far as re-writing profiles for each CCA”?
A good place to start is software in terms of profile creation.
Hot Air systems do require additional steps not necessary with Focused IR systems.
Air Flow adjustments, Wire Thermocouple attach – specifically the IC, and waiting for the PCB to cool down between test runs – specifically to derive peak temp., i.e. liquidus, are the domain of Hot Gas System whereas they are generally not part of the IR Rework Process.
You may be familiar with Hot Air software terms such as “Teach” or Learn”. PDR’s ThermoActive Software takes many of the variable manipulations required for “Teach” and “Learn” off the table. This is because PDR Software (Auto-Profile) automatically adjusts the energy required to meet pre-specified targets (IC Temps, Board Temps, etc.). This is a huge Time Saver!
Another key difference is that PDR Focused IR system software + Thermocouples/Pyrometers detects actual board temps (real-Time) and begins the reflow cycle according to actual temperatures. This is to say that if your PCB for examples is at 90 deg C, the system detects this and launches the thermal cycle according to actual temperatures. No waiting.
So.. over the years and listening to transitioning customers the feedback is “wow… that was easy”! Of course extreme rework will always have it’s profiling challenges. The good thing is that we can take your existing hot air profiles and queue up on peak temperatures, dwell, ramp rates, etc., and plug them directly into the PDR system. There could possibly be some variation in outcome but the bones are in place rather than starting from scratch.
One of the other profile related customer feedback, i.e. comparisons, items is that IR tends to be better at using the same profile for both removal and placement when compared to Hot Air systems. I would like to note however that “PDR’s Events” module (Pump Activation, Audio Alerts, Messaging) if used will require a removal and placement profile (thermal profile the same), as no need for example to activate the pick-up vacuum for placement whereas for removal this will be necessary. Same profile, different “Events”, should you choose this automation feature.
PDR’s software comes standard with a profile library consisting of Pb and Pb free profiles further defined by 3 PCB sizes, small, medium, and large. This is extremely helpful when creating profiles. For general rework these library profiles will knock out profiles all day long. For extreme rework we start with a general library profile and modify them as required to knock out tough applications. It is very common with PDR Systems to use the same profile for multiple boards and IC’s. Again.. PDR’s closed loop temperature measurement and the system’s ability to increase or decrease energy inputs automatically allows for fewer profiles than typical of Hot Air Systems.
www.pdr-rework.com
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