Printed Circuit Board Assembly & PCB Design SMT Electronics Assembly Manufacturing Forum

Printed Circuit Board Assembly & PCB Design Forum

SMT electronics assembly manufacturing forum.


BGA .75mm Real World Experience

Ron H

#7497

BGA .75mm Real World Experience | 31 July, 2001

I'm interested in process information from someone who has experience with this package, such as pad design, stencil aperture dimensions, stencil thickness, unique issues, profiling, solder paste. Design is considering this package for future products. Our process is paste, place, vapor phase, no clean, maybe wave solder depending on design. Thanks.

reply »

#7509

BGA .75mm Real World Experience | 31 July, 2001

Search the fine SMTnet Archives, for instance � square and aperture � [http://www.smtnet.com/Forums/index.cfm?fuseaction=search_results&CFApp=1] will get you started on various pitches of uBGA [wid a cuppla CSP thrown in for yucks].

reply »

Global manufacturing solutions provider

Fluid Dispensing Aerospace