Wavesolder footprint vs reflow solder footprint

I have no knowledge into PCB designing with surface mount components, all my experience has been with through hole components. I now have to design PCBs using surface mount parts. I have a few questions I was hoping someone could answer.

Can a PCB with 1206 resistors with a wavesolder footprint be manufacturer using the reflow process? Or will this cause problems in the finished product such as solder globbed joints, bridging, bad joints,ect.....

My overall question is what happens when PCBs with footprints designed for wavesoldering go through the reflow process in manufacturing, and what happens when PCBs with footprints designed for the reflow process are manufactured with the wave soldering process?

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