IPC-TM-650

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Can someone clarify whether IPC-TM-650 Test Method 2.6.27 (T... - Jul 22, 2009 by SteveO

Things that define the expected product from a board fabrica... - Jul 23, 2009 by davef

SteveO

#59349

IPC-TM-650 | 22 July, 2009

Can someone clarify whether IPC-TM-650 Test Method 2.6.27 (Thermal Stress, Convection Reflow Assembly Simultation) is required for all bare board fabricators? Or is this test method optional, depending on the type or class of boards being fabricated?

Thanks,

Steve

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davef

#59360

IPC-TM-650 | 23 July, 2009

Things that define the expected product from a board fabricator are: * Fabricator's standard process capability statement. * Buyer's purchase document. * Purchase agreement.

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