Component Pin 1 marking

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Hi, Do you know if there is any standard that specify that ... - Mar 04, 2008 by Tegel

Available on the web, JEDEC PUBLICATION 95, DESIGN GUIDE 4.1... - Mar 04, 2008 by davef

Interesting. We are placing a camera that the marking is on ... - Mar 05, 2008 by Doug Philbrick

Tegel

#53899

Component Pin 1 marking | 4 March, 2008

Hi, Do you know if there is any standard that specify that a component manufacturer shall mark a BGA component in the corner where you have the ball A1?

Best Regards,

Lars

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davef

#53909

Component Pin 1 marking | 4 March, 2008

Available on the web, JEDEC PUBLICATION 95, DESIGN GUIDE 4.14, Ball Grid Array Package (BGA), Figure 4.14-3, Note 10: A1 corner must be identified by chamfer, ink, mark, metalized markings, indentation or other feature of package body, lid or integral heatslug, on the top surface of the package. If the optional chamfered corner is used, the maximum number of solder balls N may be reduced

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Doug Philbrick

#53910

Component Pin 1 marking | 5 March, 2008

Interesting. We are placing a camera that the marking is on the bottom..... No place to put it on top! The problem with the question is the word shall! I think the answer to the question is yes there is a standard but..... no law to enforce it....just like most everything else in this business!

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