Standard for BGA void

Subscribe to Thread

I'm doing lead-free SMT of BGA with 450 micron ball. I found... - Oct 21, 2002 by

IPC-7095 has wording like: I. Void in ball ||Class1|| Acc... - Oct 21, 2002 by davef

thanks for ur help. i would also like to know the classes i... - Oct 21, 2002 by

Hi Ben, IPC610 has a pass/fail of 25% of ball volume. ... - Oct 23, 2002 by Christopher Lampron

Ben

#22050

Standard for BGA void | 21 October, 2002

I'm doing lead-free SMT of BGA with 450 micron ball. I found there are lots of voids under xray, there are around 2-3 voids in every balls. It is around 10% of volume ratio. I would like to ask if anyone know there is any standard of acceptable maximum void to solder ratio, like Jedec or other SMT standard??

This message was posted via the Electronics Forum @

reply »

davef

#22053

Standard for BGA void | 21 October, 2002

IPC-7095 has wording like: I. Void in ball ||Class1|| Accept|| Reject ||||60% of ball diameter|| >60% ||||36% of ball area|| >36% ||Class2|| Accept|| Reject ||||45% of ball diameter|| >45% ||||20.25% of ball area|| >20.25% ||Class3|| Accept|| Reject ||||30% of ball diameter|| >30% ||||09% of ball area|| >09% II. Missing Ball: This is prohibited, any evidence is reject. III. Short ball / Bridging: Any evidence is reject. IV. Open ball: Any evidence is reject. V. Popcorning: Any evidence is reject

reply »

Ben

#22054

Standard for BGA void | 21 October, 2002

thanks for ur help. i would also like to know the classes is for showing different level of requirement, or for different vertical location of void in joint. coz I heard from my workmate that the range from 9% to 36% is for void at different vertical locations.

This message was posted via the Electronics Forum @

reply »

Christopher Lampron

#22113

Standard for BGA void | 23 October, 2002

Hi Ben,

IPC610 has a pass/fail of 25% of ball volume.

Hope this helps

reply »