I might need some help to explain what I'm seeing here. The first 3 look like before pictures. They seem ok. The last 3 look like after pictures. It doesn't look like fracturing joints as would be a normal failure for vibration test, more like it reached close to liquidus temperature and loosened the bond, causing splash during vibration.
-or-
These are your spray cooling and room-temperature cooling batches. In that case, same concept, but different cause. It's reaching liquidus and the handling during removal is disturbing the bond.
Either way, my suggestion is the vibe temp. chamber is too hot or the manufacturer isn't using solder rated for that temperature. Are you spraying before moving or after moving?
-Also, what kind of 3D scanner are you using? We've been thinking about getting one.
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