I am working in electronic automotive industry and today we are facing to a very serious problem : if we want to use a PCBoard with a copper thickness of 90�m + fine pitch circuit (0.65mm, 0.5mm) the supplier(several) of the PCB has some trouble to obtain the correct size pad for this type of pitch because the process used at each time (chemical attack)are closed to it's limit ; so the process capability in this case are very low .The result are a lot of soldering problem during SMT phase. I am looking for some people who have experiences in this field and who are opened to answer and give their point of view/alternative ... thank you
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