Electronics Forum: bga (Page 9 of 546)

I want to learn about bga technology from a pick and place mache

Electronics Forum | Wed Jul 14 16:03:25 EDT 2010 | malcolmlanders

I seemed to have learned that on the bga chip that the soider is the soider balls on the chip. If this is true how do you get the chip to not move on the board when being inspected bdfore you soider it. and even in the transport of the board to the o

I want to learn about bga technology from a pick and place mache

Electronics Forum | Fri Jul 16 15:21:26 EDT 2010 | davef

Duno. I'll shoot Daan an email.

I want to learn about bga technology from a pick and place mache

Electronics Forum | Fri Jul 09 20:39:31 EDT 2010 | malcolmlanders

I have never placed a bga chip before and need to know some o0f the basics of how to do it. I am really intrested in how the stencil will work with the soider and if there is a special soider that i need to use. I usually use a leaded soider from man

specs or guidlines for how many times you can rework a bga site

Electronics Forum | Tue Oct 15 20:33:43 EDT 2002 | davef

First, this is a very interesting question. Second, there is no specification. Third, companies develop guidelines for rework based on their expectations for their product reliability. Things to consider are: * Motorola allows no product shipments

Collapsing of micro bga ball due to improper land pad design ?

Electronics Forum | Fri Aug 22 03:19:08 EDT 2008 | andrzej

Hi, what do you mean by collapsed ? Can you describe or send a photo ?

Collapsing of micro bga ball due to improper land pad design ?

Electronics Forum | Mon Aug 25 08:44:10 EDT 2008 | rameshr

Dear Andrezj, i had attached the photos for ur reference Kindly advice.

Collapsing of micro bga ball due to improper land pad design ?

Electronics Forum | Mon Aug 25 10:36:05 EDT 2008 | davef

Yes, it's peculiar that the layout of this board is so disorganized * Pads are not round, uniform, or the same size * Exposed traces have different thickness

Collapsing of micro bga ball due to improper land pad design ?

Electronics Forum | Wed Aug 27 00:20:38 EDT 2008 | rameshr

Dear davef, Will u pls advice what are all the possible defects caused while soldering ( assembling ) this type of boards.

Collapsing of micro bga ball due to improper land pad design ?

Electronics Forum | Wed Aug 27 08:25:24 EDT 2008 | davef

We'd expect to see: * Solder starved connections at pads with large trace/pad areas. * Less reliable solder connections at pads that do not match the shape and size of the corresponding pads on the component.

I want to learn about bga technology from a pick and place mache

Electronics Forum | Wed Jul 14 16:10:07 EDT 2010 | malcolmlanders

I can't access these web pages do I have to log in somewhere


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