Equipped with a "Clear Vision Capturing System", the RV-1 is capable high-speed and high-precision inspection. The RV-1 captures super clear images using a large sized ring light and coaxial light and enables easy operation by using a newly develope
Equipped with a "Clear Vision Capturing System", the RV-1 is capable high-speed and high-precision inspection. The RV-1 captures super clear images using a large sized ring light and coaxial light and enables easy operation by using a newl
This is a brief demonstration showing the 2014 YESTech FX operating. This machine is available at the Capital Equipment Exchange. www.ce-exchange.com
AOI technology has been proven as highly efficient for PCB manufacturing process improvement and quality achievement. EKT strives to be your most reliable AOI supplier. cathysun@ekt-tech.com mb/wechat: +86-18320811289
Achieve higher quality and labor savings by automating manual insertion. The JM20 automates the manual insertion process and is the advanced model for larger/heavier components and larger boards. Placement or Insertion of Surface Mount & Thro
http://www.my-smt-fox.com/ Essemtec Fox can have up to 180 feeder lanes, needs only 1sqm of floor space and can accept PCB’s of up to 406 x 305 mm. -Compact footprint -Quick changeover -Dispense option available -Intuitive operatio
EKT AOI machine application: inspection after stencil printing, pre/post reflow oven, pre/post wave soldering?FPC etc. Stencil printing: Solder unavailability, insufficient or excessive solder, solder misalignment, bridging, stain, scratch etc. Compo
Enter PACE’s TF Series BGA/SMD Rework Systems. With its groundbreaking, patented Inductive-Convection Heating Technology, the TF Series top-side heater reaches the target temperature in just seconds for safe, rapid solder joint reflow in virtually an
Enter PACE’s TF Series BGA/SMD Rework Systems. With its groundbreaking, patented Inductive-Convection Heating Technology, the TF Series top-side heater reaches the target temperature in just seconds for safe, rapid solder joint reflow in virtually an