Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/proceedings_abstract.cfm?PROC_ID=5218
. One of the QFN components showed the expected decrease in reliability with increased board thickness, while the second QFN component had less of a reliability dependence on PCB thickness
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/journal.cfm
, Chonglun Fan, and Raiyo F. Aspandiar Abstract 25-4 Bottom Termination Component Land Pattern Design and Assembly For High Reliability Electronic Systems Scott Nelson Abstract 25-4 Study of Sulfide Films Grown on Printed Circuit Boards Anil Kurella, Ph.D. and
Surface Mount Technology Association (SMTA) | https://www.smta.org/directory/directory.cfm
: ALL Adhesives/Dispensing Equipment Antistatic Products/Equipment CAD/CAM Systems & Software Cleaning Equipment & Supplies Component Packaging Component Preparation Components/Substrates Consulting Contract Assembly Design Services Failure
Surface Mount Technology Association (SMTA) | https://www.smta.org/training/
. Register Now Courses Currently Available Stencil Printing 101 Get Details Component Placement 101 Get Details Reflow Soldering 101 Get Details Wave Soldering 101 Get Details Selective Soldering 101 New
| https://www.eptac.com/faqs/ask-helena-leo/ask/vapor-phase-soldering-to-immersion-tin-plated-pads
. I’ve copied the abstract for your information, complements and copyright of IEEE: “…The focus of this work is the tin oxide characteristics and their influence on solderability
Surface Mount Technology Association (SMTA) | https://www.smta.org/chapters/chapters_detail.cfm?chapter_id=16
:00PM Effects of Mixing Solder Sphere Alloys with Bismuth-based Pastes on the Component Reliability in Harsh Thermal Cycling Webinar Douglas Philbrick
Surface Mount Technology Association (SMTA) | https://www.smta.org/smtai/call_for_papers.cfm
@smta.org Advanced Packaging/Components: 2.5/3D Packaging and Integration BGA/CSP Biomedical Packaging Component Storage Connector Technology Copper Pillars Copper Wire Bonding Diffusion Bonding Embedded and Miniature Passives Environmental
| https://www.eptac.com/ask/vapor-phase-soldering-to-immersion-tin-plated-pads/
? More Questions Component Rework Clarification Soldering Minimum Space Requirements Gum and Hard Candy at a Workstation Soldering onto Platinum Pins Inspection Criteria for Unique Lead Geometry Question
| https://www.eptac.com/class/j-std-001-specialist
. Module 1 is a prerequisite to all other modules. Course Overview Safety EOS/ESD Classes of Equipment Solder Theory Solderability Solder Flux and Solder Alloys Facilities, Tools
| https://www.eptac.com/faqs/ask-helena-leo/ask/wave-solder-machine-flux-system-testing-on-a-budget
. I would also strongly suggest reviewing J-STD-002 and J-STD-003 for the solderability test for wires, terminals and boards. It is imperative this is done to make sure
