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: solder balls Solder balls are very small fines of solder that have separated from the main body that forms the joint. Their formation is promoted by excessive oxides in the solder paste that inhibit solder coalescence during reflow
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/chip-array-solder-joint-goals_topic483_post1439.html
. The are solder joint goals for micro-miniature components must be reduced to avoid excess solder to prevent solder balls and tombstoning
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/topic483&OB=DESC.html
. The are solder joint goals for micro-miniature components must be reduced to avoid excess solder to prevent solder balls and tombstoning
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/topic483&OB=ASC.html
. The are solder joint goals for micro-miniature components must be reduced to avoid excess solder to prevent solder balls and tombstoning
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resources/solder-faqs
! This will contaminate the unused paste and degrade its performance. Process and Inspection I’m getting solder balls on the sides of my chip components
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:0 Solder Ball Defects Defect: solder balls Solder balls are very small fines of solder that have separated from the main body that forms the joint
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:2 Solder Ball Defects Defect: solder balls Solder balls are very small fines of solder that have separated from the main body that forms the joint
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/products/solder-paste-and-soldering-equipment?con=t&page=4
to manage those variables to your advantage. Productronica 2017 Nordson Corporation Precisely where you want to be – Come see Nordson’s many new solutions for electronics manufacturing ControlFlow Solder Nozzles Nordson SELECT ControlFlow nozzles greatly reduce dross creation and eliminate formation of solder balls during the
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/products/solder-paste-and-soldering-equipment?con=t&page=5
. Selective Solder Nozzle Technology for Reduced Dross and Solder Balls Nordson SELECT Toivo Mykkanen and Bob Klenke (Circuitnet, July 2020
| https://www.eptac.com/soldertip/solder-paste-shelf-life-and-testing/
. The adverse affect would be un-reflowed solder paste, insufficient reflow, solder balls, dewetting, etc. The recommendations would be to perform a solderability test, slump test and flux activity test on the solder paste itself and see if it still performs to the original standards of the material
