Electronics Forum | Wed Sep 11 16:57:04 EDT 2002 | bigwop
I've seen this problem caused by the cool down. > On a 7 zone oven I made a profile to peak at zone > 5 to give some semblance of control to the cool > down. The component can develope a big delta T, > because of the difference of materials Che
Electronics Forum | Tue Sep 07 22:15:26 EDT 1999 | NAZEEH CHAUDRY
| | | I have a zevatech 570 and 560 my boss want to place bga.s with these machines, Ive told him he needs to ugrade to newer machines. Zevatech say "no problem our machine are number 1". | | | these machines dont even offer bga selections. These mac
Electronics Forum | Fri Sep 17 13:26:43 EDT 1999 | The Guc
| | I have a zevatech 570 and 560 my boss want to place bga.s with these machines, Ive told him he needs to ugrade to newer machines. Zevatech say "no problem our machine are number 1". | | these machines dont even offer bga selections. These machine
Electronics Forum | Tue Sep 07 06:14:27 EDT 1999 | Earl Moon
| | I have a zevatech 570 and 560 my boss want to place bga.s with these machines, Ive told him he needs to ugrade to newer machines. Zevatech say "no problem our machine are number 1". | | these machines dont even offer bga selections. These machine
Electronics Forum | Tue Sep 07 22:07:56 EDT 1999 | NAZEEH CHAUDRY
| | | I have a zevatech 570 and 560 my boss want to place bga.s with these machines, Ive told him he needs to ugrade to newer machines. Zevatech say "no problem our machine are number 1". | | | these machines dont even offer bga selections. These mac
Electronics Forum | Thu Sep 05 03:23:14 EDT 2002 | manic
Hi, I encountered a problem with pbga. One edge either warp downwards or upwards creating bridging or open. This pbga have fr4 at the bottom (compound molding at the top). The fr4 is bigger than the top compound by 3mm at each edge. Pls help. Than
Electronics Forum | Tue Sep 10 08:22:36 EDT 2002 | davef
I doubt that the interposer is FR4, it's more likely to be BT. Warp during reflow is a function of material a reflow recipe. Your ramp is too fast and is causing the interposer to bend like a potato chip.
Electronics Forum | Wed Sep 11 13:20:37 EDT 2002 | stepheno
I've seen this problem caused by the cool down. On a 7 zone oven I made a profile to peak at zone 5 to give some semblance of control to the cool down. The component can develope a big delta T, because of the difference of materials
Electronics Forum | Wed Sep 11 23:20:44 EDT 2002 | scottefiske
Profiles are absolutely the first course of action to validate. A few additional questions would be: * Moisture can cause warping as well, verify the manufacturers recommended handling procedures were followed. * Where is the suspect BGA located
Electronics Forum | Mon Oct 13 13:49:29 EDT 2003 | mrmaint
Does anyone know of a standard stencil thickness for BGA'S. We currently use 4 to 5 mil stencils depending on component mix. Is an aperature reduction required for BGA'S. If so what percentage. Any help would be greatly appreciated. Thanks MRMAINT
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