Electronics Forum | Tue Mar 09 17:41:24 EST 2004 | davef
Try this: * Run the board through your reflow oven set for a "normal" recipe, but with the cooling section turned off. * Pick the BGA from the board while the solder is still liquid using tweezers [or similar tool].
Electronics Forum | Mon Jul 12 13:02:38 EDT 2004 | jasont
anybody doing bga placement w/Fuji IP2? what is required if it is possible (camera, nozzles, s/w, etc.), thanks
Electronics Forum | Fri Mar 19 10:02:44 EDT 2010 | karlo
There is a wide range of BGA underfills to satisfy specific needs. Some are designed for those who place a premium on high speed, high volume processing, shock or drop test perforamnce, and ease of reworkability. Others are designed for those who p
Electronics Forum | Thu Nov 16 05:28:59 EST 2000 | Jacqueline
Heres my mail address; jacqueline_coia@solectron.co.uk
Electronics Forum | Sun Oct 06 22:23:05 EDT 2002 | CH
Hi Eric, How to access to the Compaq Houston reprot. regds
Electronics Forum | Mon Oct 07 09:06:20 EDT 2002 | davef
Look here: http://www.smta.org/knowledge/proceedings_abstract.cfm?PROCEEDING_ID=898
Electronics Forum | Tue Mar 09 22:41:50 EST 2004 | pdeuel
Frustrations to relieve try a sledge hammer.
Electronics Forum | Wed Mar 17 14:59:53 EST 2004 | Claude_Couture
since there is a bit of humor in this thread, try drilling the pads from the opposite side of the pcb.
Electronics Forum | Thu Sep 12 09:15:29 EDT 2002 | mhoughton
I have printed and placed similar devices in high volume with exactly this spec for a couple of years with no problems, are you using laser cut stencils and what type of solder paste are you using? and what is the end use of the product as it may nee
Electronics Forum | Tue Jul 13 00:40:44 EDT 2004 | Darren
Yes of course we are doing placement of BGA's with an IPII. However there is no front lighting so you can not inspect the balls. If the silhouette is square enough there is no problem with alignment. Just use the largest nozzle that will fit on the p
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