Electronics Forum | Tue Jan 13 22:07:42 EST 2004 | davef
No, there is no such information. Choices are: * Recognize that any voiding is a process indicator and that when observed, indicate a requirement for taking corrective steps. * Tell your quality people to quit looking at components other than BGA wi
Electronics Forum | Wed Jul 14 07:47:41 EDT 2004 | pcbrown
I am looking for effective ways to secure through-hole components (non-clinched) to the boards for wave soldering. Can someone share their ideas or methods? We've tried vacuum packing & tacking/masking, but there must be better ways. I'd appreciate a
Electronics Forum | Sat Aug 13 11:14:11 EDT 2005 | Ftiscar
Does any body knows if there is a design rule on copper pads against component weight so they do not drop on secon reflow process?
Electronics Forum | Tue Aug 12 08:34:31 EDT 2008 | rameshr
hai, in our smt process we are facing the following problem. The Case A tantalum capacitor used in our PCB assembly - during reflow process get shifted, due to which other components nearby that also found missing. what are the causes for this proble
Electronics Forum | Thu Dec 27 02:57:49 EST 2007 | gersla
17 mm x 17 mm or any stacked die package). What is stacked die package? Can you send me a picture of such a component? Thank you in advance,
Electronics Forum | Wed Jun 18 11:34:23 EDT 2008 | slthomas
"And we have evaluated this process before 2001." How did you quantify the level of moisture left in the components after the bake?
Electronics Forum | Wed Jul 14 19:23:21 EDT 2010 | davef
So, tell us more ... * Is this at in-bound inspection? Where do you observe this? * Does this affect the whole component, just terminations, ... * Could the 'brownish' be interpreted to be 'purplish'? * How wide-spread is this [eg, multiple products
Electronics Forum | Wed Jul 21 14:33:56 EDT 2010 | davef
Bingo!!! Craig: You say, "I have seen several instances where the same component turns brown located directly next to another that does not." What's the difference between the two?
Electronics Forum | Wed May 08 04:46:25 EDT 2013 | mbb
Hello, I want to ask what are causes that could engender rejected components in Panasonic pick and place machine?
Electronics Forum | Sat Aug 12 02:52:16 EDT 2017 | tsvetan
There is no solution in above case, this is caused by the PCB design. There are no thermals on the pads connected to the copper poured area. So the other pad reflow first and lift the component.
