Heller Industries Inc. | https://hellerindustries.com/solder-balls-defects/
(overlapping solder mask) Misaligned solder mask (overlapping solder pad and print area) Flux is too weak for the oxidation level of the board and/or components Components have marginal solderability
Heller Industries Inc. | https://hellerindustries.com/solder-ball-defects/
(overlapping solder mask) Misaligned solder mask (overlapping solder pad and print area) Flux is too weak for the oxidation level of the board and/or components Components have marginal solderability
Heller Industries Inc. | https://hellerindustries.com/solder-balls-defects
(overlapping solder mask) Misaligned solder mask (overlapping solder pad and print area) Flux is too weak for the oxidation level of the board and/or components Components have marginal solderability
Surface Mount Technology Association (SMTA) | https://www.smta.org/msd/msd.cfm
. Companies and institutions represented include electronic manufacturers and users, research laboratories, consultants, universities, component manufacturers, and manufacturers of related products
| https://www.eptac.com/faqs/ask-helena-leo/ask/63-37-versus-lead-free-solder
. Check the flux content data from the manufacturer for compatibility. Depending on the customer and what Class product, there may be defect conditions related to solderability and traceability
| https://www.eptac.com/faqs/ask-helena-leo/ask/silver-immersion-finish-boards
. Baking will impact the solderability of the board, especially if they are as stated immersion silver boards. My recommendation is to assemble a board, bake it for at least 8 hours and process it through the wave solder process
| https://www.eptac.com/soldertips/solder-paste-shelf-life-and-testing/
. The other issue with solder paste is the function of the flux. In plated through hole soldering the flux is used to prepare the component leads and the circuit board prior to soldering
| https://www.eptac.com/faqs/ask-helena-leo/ask/gold-removal-on-bottom-only-smt-rf-components
“bottom only” and the castellations are gold. Is there anything we can do about the 75% gold removal rule? Answer: If you check J-STD-002, you will see the methods to check for solderability of those components
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/blog/012419-halogens-and-halides-consider-halogen-free-flux-and-solder-paste
. A consequence is that many do not wet as well and have a smaller profile process window. Component lead solderability has a greater effect on joint quality
