Electronics Forum | Thu Oct 02 17:00:44 EDT 2008 | davef
Is that accurate? If so, what are your aspect & area ratios? [Similar to the JerryS comment above.] * You say, � � and the average height is very high: nearly 200 pct.� => Our troop can make paste that height too. They snap the stencil-off a fast as
Electronics Forum | Thu Oct 02 12:22:26 EDT 2008 | JerryS
Hello Ok there is not much info here. What you have to mae sure of is several key factors. 1. Have you entered the correct stencil thickness. 2. Are you using the stencil gerber (not the paste layer) The paste layer is usually not adjusted for ap
Electronics Forum | Fri Jun 08 01:25:02 EDT 2018 | buckcho
Hello, good choice! Koh young makes great reports for cpk. Only one advice. If you take 50panels from production and your cpk seems low, try to group the different kinds of components. Because also cpk on a whole panel would be not good number as wel
Electronics Forum | Wed Apr 18 17:29:14 EDT 2018 | emeto
Can you send me a screenshot to see how it looks or a spreadsheet of the data? Do you have to modify anything on your own? Can you do it for some selected components/apertures or it has to be on the whole PCB? Any further info will be appreciated.
Electronics Forum | Mon Dec 29 14:47:36 EST 1997 | justin medernach
| how to determine the optimum solder paste height ? Ray, This is a gross misconception within the industry. There is no optimum solder paste height, per say. The effectiveness of a solder joint should be quantified in volume. Use your process as
Electronics Forum | Thu Jan 27 10:22:21 EST 2000 | JAX
Dennis, Not sure why your so secrative about what machine but I guess it doesn't matter. When you start placing 0402 & 0603 packages the difference between height and width and length gets lost in tolerance. This allows the machine to pass parts t
Electronics Forum | Thu Jan 27 07:18:14 EST 2000 | Christopher Lampron
Dennis, The solder paste is responsible for holding the component in place pre-reflow. Several things to look at: Is the paste accurately printed on the pad? If not, there may not be enough of the component in contact with the paste to provide adiq
Electronics Forum | Thu Jan 27 19:14:27 EST 2000 | Dennis
Thanks! It is right that solder paste is somewhat responsible for misssing components in our case. I took a look at the board after placement and I found that component hit the paste, but no where on the board. I guesss dry solder paste (operater pri
Electronics Forum | Wed Mar 30 08:06:17 EST 2005 | davef
Considerations are: * If the nonwetting is component lot specific, the could be solderability issues with that lot. * If the nonwetting is is a broader based component issue, the solderability protection on the component may require a different reflo
Electronics Forum | Thu Mar 05 20:32:17 EST 2009 | davef
Most likely, placing components will smush the higher points on the edges of your paste deposit
