Inline x-ray inspection system for combined 3D and transmission x-ray analysis of double-sided boards with high package density. Universal standard system based on the MatriX X2.5 AXI system motion concept with 360º angle shot coverage. A new 3D reco
New Equipment | Wave Soldering
Industrial PC control System Long lifetime and Good heat uniformity of solder pot Special design to implement less solder residue generated Patented design of impeller & channel for improving soldering wave stability Spraying evenly and minimized
New Equipment | Wave Soldering
Industrial PC control System Long lifetime and Good heat uniformity of solder pot Special design to implement less solder residue generated Patented design of impeller & channel for improving soldering wave stability Spraying evenly and minimized the
New Equipment | Rework & Repair Equipment
IR2015 Infrared reflow soldering section of BGA rework system Infrared temperature sensor monitors BGA surface temperature directly, realize close loop control, ensure precise temperature technical window and even heat distribution. PL2015 Precise
New Equipment | Test Equipment
The Hitachi High-Technologies line includes several configurations for in-house RoHS inspection but the Hitachi 6000VX x-ray fluorescence analyzer is considered the premier system for this interest. The reason? This model features the high precisio
Acculogic introduces StatManager™ - an advanced test program coverage report generator with boundary scan fault inject capability. StatManager can calculate part and pin level coverage of Teradyne Spectrum and Teradyne Z18xx test programs. StatMana
Automatic high-speed in-line inspection system for electronic devices and assemblies. Featuring transmission x-ray technology, intelligent handling system for fast loading/unloading as well as MIPS software solutions for inspection of single-sided an
3D CT AXI equipment exclusively for mass production inspection of assembly electronic component The world's only assembly electronic components, small die casting products, etc. can be inspected automatically and can be used reliably for a long
Wafer-level Product In-line(Ireland) 2D, 3D CT AXI Machine Automatic inspection equipment exclusively for the Wafer-level products and ultra-fine defects of mm can be detected using the Nano Tube of Class Focal spot 200nm. 2D, as well as 70&o
New Equipment | Industrial Automation
2 Ohm Current Regulated, ±5 mA accuracy, short circuit proof Dither Adjustable from 0 to 30 % in 0.1 % of Irated Dither frequency 40 to 500 Hz Characteristics Ramp rising/falling time 1 ms to 15 s Ramp range Adjustable ramp time, min/max limit config
