Electronics Forum: electronic components[0] (Page 1 of 1)

Assembleon / Philips

Electronics Forum | Wed Feb 24 04:22:38 EST 2016 | dzadza

Hi, I'm trying to use the PCB SYNERGY software, when I press the process button the following message appears. PADS ASCII 2005 file in development!... NoSMTComponents = 0 NoComponents = 0 NoSMTFeeders = 0 NoFeeders = 0 This file is suitable for SM

DEK 265GS

Electronics Forum | Wed Feb 09 09:59:25 EST 2005 | aj

Randy, We have a Dek 265GSX and 265 MK1. We print 20thou pitch components, 0.5mm. Just make sure you have good board support and USC. aj

Yamaha Machine

Electronics Forum | Wed Sep 06 06:04:16 EDT 2000 | Dreamsniper

Hi Guys, I'd like to collect info regarding YAMAHA YV88 Mark2 and YV100 series. Are they of any good compare to Universal GSM1 or Panasert MPAV2 ? My new company's products have hips of fine pitch components (0.5mm) and we are planning to get new eq

fine pitch on thick copper

Electronics Forum | Mon Dec 20 07:58:02 EST 1999 | pascal MATHIEU

hello guys ; we are using a fine pitch component(0.65mm) on a thick copper PCB (Cu = 90�m) ; in this case we notice that we are in the process'limits , because the different supplier of the PCB are not able to ensure a good stability of it's process

Fuji CP6 and IP3 specifications request

Electronics Forum | Fri Aug 05 08:15:39 EDT 2016 | jdengler

The IP3 specs are: PCB Dimensions Max: 508 mm x 457 mm - Min: 80mm x 50mm Thickness: 0.8 to 4.0mm Component Capacity Tape: 74 - 8/12mm Device Locations Tray: 40 Locations Placing Rate: 0.55 sec/component for small chips 1.25 sec/component for ICs

Odd problem on GSM2 running USOS 4.52

Electronics Forum | Sat Apr 01 16:41:01 EDT 2023 | dilogic

Today I stumbled upon very odd issue - we have one GSM2 with FlehJet heads on both axes. New program was created and it stops on the first task for Head2 throwing out a message like this: "Component 0u1/0805 (reference id C4) can't be found wit

Step-up stencil: recommendation thickness

Electronics Forum | Mon May 20 12:01:37 EDT 2019 | gregoireg

I have a PCBA job which has on the top side a few standard QFN components (0.4mm pitch) and a big module (35mmx60mm) with 1.13mm BGA pads: https://imgur.com/a/YUGgejW To be clear, this module is composed of a PCB with some components on top and some

Yamaha/Philips Model Number Cross References

Electronics Forum | Thu Jul 07 19:39:18 EDT 2005 | darby

This is a very difficult question to answer as it will depend greatly on your component mix. I will presume that the CSM 84VZ is of the following configuration: 2 x RDC Synchro Heads. Heads 1 & 2. These are mechanically centering heads with a chucki

Re: DFM / DFT information

Electronics Forum | Thu Jul 13 22:20:38 EDT 2000 | Dave F

=10 mils larger than lead 3 silk screen legend text weight >=10 mils 4 pads >=15 mils larger than finished hole sizes 5 place through hole components on 50 mil grid 6 no silk screen legend text over vias (if vias not solder masked) or holes 7 so

  1  

electronic components[0] searches for Companies, Equipment, Machines, Suppliers & Information

Winsmart Electronic Co.,Ltd
Winsmart Electronic Co.,Ltd

Manufacturer of PCB depaneling and PCB soldering machines since 2005, products include CE approval V-groove PCB depanelizer, PCB router, PCB punching machine, laser depaneling, hot bar soldering machines and soldering robots.

Manufacturer

Liwu Industrial Park, Yuanzhou Town, Boluo
Huizhou, 30 China

Phone: +86-138-29839112

Blackfox IPC Training & Certification

Benchtop Fluid Dispenser
Electronic Solutions

Component Placement 101 Training Course
convection smt reflow ovens

Software programs for SMT placement and AOI Inspection machines from CAD or Gerber.
2024 Eptac IPC Certification Training Schedule

World's Best Reflow Oven Customizable for Unique Applications