Electronics Forum | Thu Oct 24 03:03:13 EDT 2002 | harriss
Hi: The component height will increase on the PCB after reflow soldering. But i don't know the accurate data of the increased height. Who can help me to get it? The stencil thickness is 5 mil we used. Thanks Harriss
Electronics Forum | Thu Oct 24 13:32:03 EDT 2002 | russ
There are many factors that will affect post soldering height. Lead shape/type, pad geometry, fillet formation, etc... You will need to measure each type of component before and after reflow. Russ
Electronics Forum | Thu May 13 17:07:44 EDT 2004 | Longhua
Try TESTRONICS 505 series. Ask for literature on this subject. They are a very responsive company.
Electronics Forum | Thu May 13 09:47:32 EDT 2004 | Lubo
We are looking for a inspection system to check the positioning of a component over a PCB. We need it positioned both in X Y directions and height above PCB (it is a TH component) to be within certain limits. PLS advise can this be achived by AOI. Wh
Electronics Forum | Mon Feb 21 04:04:21 EST 2005 | abhirami
1.67 always on the sample boards measured. This is very fast and pretty good measurement for a paste dispense control. Boards do not stand out-side for long times. Inspect the height for critical components only, in the initial stages. Once your Cpk
Electronics Forum | Sat Apr 25 19:40:01 EDT 1998 | Stan Traxler
| We have to mount our SMD devices 0.1 to 0.4 mm off the pcb | PCb substrate to compensate for thermal stressing in a | Space enviroment. Has any one any ideas or contacts for | dissolvable pads. this only applies to leadless components We have appl
Electronics Forum | Mon Feb 21 03:51:37 EST 2005 | abhirami
Solder paste thickness control is more important in SMT process. What controls do you have? I guess if everyone follows the critical control path, then there are always reduced problems. The issue is no one is perfect. Paste tends to be on the stenci
Electronics Forum | Wed Mar 30 08:06:17 EST 2005 | davef
Considerations are: * If the nonwetting is component lot specific, the could be solderability issues with that lot. * If the nonwetting is is a broader based component issue, the solderability protection on the component may require a different reflo
Electronics Forum | Wed Mar 30 01:01:10 EST 2005 | vicknesh28
All, Has there been any finding from the component point of view in terms of non wets after reflow and if yes, can anyone share what was improved on the component to reduce the non wet defective levels. What would be the contribution from the compon
Electronics Forum | Thu Mar 05 20:32:17 EST 2009 | davef
Most likely, placing components will smush the higher points on the edges of your paste deposit
