Industry Directory | Distributor / Manufacturer
Electronics Manufacture and Distribution in London
New Equipment | Curing Equipment
Heller 788 In-line, Continuous Cure, Vertical Format Oven This elevator format oven utilizes vertical space to accomodate curing applications of up to 4 hours while only occupying 96" (2.5m) of floorspace. Perfect for underfill and encapsulant.
Singulation No mechanical stress on substrates or circuits No tooling cost or consumables. Versatility – ability to change applications by simply changing settings Fiducial Recognition – more precise and clean cut Optical Recognition before
Used SMT Equipment | Coating and Encapsulation
Reflow oven by Technoprint in good condition. Technoprint Mistral 260 Product information: Forced air convection reflow oven heat to maximum temperatures of up to 300°C. Forced air convection provides uniform heating and prevents shadowing. Th
Used SMT Equipment | Soldering - Reflow
Heller 2043 MK5 Reflow Oven is an ultra-high volume reflow oven. The Heller 2043 offers the lowest delta T’s, reduced nitrogen and electrical consumption and advanced flux management options. The 12” wide heater modules offer profile compatibility wi
Industry News | 2003-05-29 08:30:31.0
Losses halved in the first half year � New organization of electronics group next on the agenda
Industry News | 2018-10-18 08:37:41.0
How to optimize the reflow profile?
Technical Library | 2014-12-24 19:22:52.0
For centuries, the squeegee blade has been used throughout many applications for depositing viscous materials through screens and stencils to transfer images on to substrates, from cloth material to electronic circuit boards. One area of blade printing mechanics that have been reviewed many times is the angle of attack of the blade. Typically it has been tested from 45 degrees to 60 degrees to optimize the printing quality and efficiency. However, this typically ends up as a compromise, from fill characteristics (45 degrees) to print definition (60 degrees). This paper will present the revolutionary performance of the profiled squeegee blade, which has recently been developed to create a virtual multi angle of attack for unsurpassed process control for all types of stencil printing processes.
This elevator format oven utilizes vertical space to accomodate curing applications of up to 4 hours while only occupying 96" (2.5m) of floorspace. Perfect for underfill and encapsulant.
The LPKF ProtoFlow S reflow oven, with lead free capability, has significant advantages over previous models and rich features including a PC control software package. Learn more: http://www.lpkf.com/products/rapid-pcb-prototyping/smd-assembly/solder
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Webinar: Networking in a Virtual World
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Great Lakes Chapter Meeting: Flexible Wave Solder Processes and Optimization
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I was born on June , 1972 in Khmelnitsky city , Ukraine . I am male. From 1979 to 1987 I was studying at secondary school #7, having finished which I entered the Technical College of Khmelnitsky in specialty Machine Tools with Computer Numeric Contr
| https://ipcapexexpo.org/registration
Engineers, Attendee Profile (to connect with attendees and exhibitors). As IPC APEX EXPO 2021 goes virtual, face-to-face standards development meetings scheduled for March 2021 will also be moving to a virtual environment
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. So, you must analyze your target board first before creating a unique reflow profile. Make an virtual reflow profile. A virtual reflow profile is based upon soldering theory, the recommended solder profile from the solder paste manufacturer, size, thickness, cooper weight, layers of the board and size, and the
