Industry Directory | Manufacturer
Semiconductor package substrate manufacturer, IC substrate manufacturer
Hi-Q Materials provides prototypw, quickturn substrates with fine line geometry. Also sell equipment for substrate fab using photoimagable technology. R&D in advanced packaging materials.
Precision Dispensing System for Heated Dispense Applications The GPD Global MAX II is a compact; high-accuracy system designed for today’s advanced heated dispensing applications. The frame is molded from “liquid rock” which gives the system a stabl
Full-featured and compact benchtop dispense system robot offering accurate and repeatable dispense results! A benchtop dispense system does not mean "no features". The Catalina benchtop dispense system is a full-featured platform with these standard
Used SMT Equipment | Screen Printers
2.0 Cmk @ ± 12.5 μm (± 6 sigma) System alignment capability > 2.0 Cmk @ ± 25 μm (± 6 sigma) Optimum core cycle time 8 seconds Substrate size 50 mm (X) x 40.5 mm (Y) to 620 mm (X) x 508.5 mm (Y) Operating System Windows 7 Embe
Used SMT Equipment | Pick and Place/Feeders
Product number: FX-3 Detailed product introduction FX-3 JUKI parameters The best conditions: 0.040 seconds / chip(90000CPH) * The laser head*4 (24 nozzle) 0402 chip ~33.5mm square elements (ordiagonal Long 47m) Feeder number: up to 120 (using
Industry News | 2016-06-27 14:59:09.0
GPD Global introduces the NEW TempView Thermal Imaging System that ensures the success of heated dispensing processes like Underfill, Encapsulations, Dam and Fill, and more. The TempView Thermal Imaging System monitors the temperature of the entire substrate for complete heat profile characterization. Regions of the product may be selected for monitoring during the heating process. Now you can accurately monitor temperature of specific devices to be sure they are up to temperature before starting a process.
Industry News | 2016-11-07 16:28:47.0
GPD Global expands the performance of its automated dispense systems to run fundamental Pick & Place operations.
Technical Library | 2020-01-28 00:23:58.0
This paper explores new advances in the reflow soldering process including vacuum technology and warpage mitigation systems. The first topic for discussion will be the implementation of a vacuum process directly in a conventional inline soldering system. The second topic presented is the mitigation of warpage on substrates or wafers.
Technical Library | 2023-08-16 18:42:25.0
In one of our medical applications projects, the customer wanted to dispense a mask to protect gold leads and an underfill on a silicon substrate with a clear test die. The substrates were Dymax X-499-91-C for Masking and Epoxibond-106M-1 for Underfill Dispensing
Precision Dispensing System for Heated Dispense Applications The GPD Global MAX II is a compact; high-accuracy system designed for today’s advanced heated dispensing applications. The frame is molded from “liquid rock” which gives the system a stabl
High Precision Dispensers - MAX Series (Non-Heated) Max Series is capable of a wide variety of dispense applications including MicroVolume, Solder Paste and Conductive Adhesive, Underfill, Surface Mount Adhesive, Dam and Fill, Encapsulations, LED En
Training Courses | ONLINE | | PCB Assembly Courses
The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.
Training Courses | ONLINE | | PCB Assembly Courses
The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.
Events Calendar | Wed May 12 18:30:00 UTC 2021 - Wed May 12 18:30:00 UTC 2021 | ,
Joint Chapter Meeting: Photonic Soldering
Events Calendar | Sun Sep 13 18:30:00 UTC 2020 - Sun Sep 13 18:30:00 UTC 2020 | ,
Printed Circuit Board (PCB) Inspection & Quality Control
Career Center | Dallas, Texas USA | Engineering
Job description: Engineer is responsible for the design of RF, Microwave and support circuitry for miniaturized Rf/Wireless modules utilizing highlt integrated semiconductors and an array of substrate and packaging technologies. Will design, simula
Career Center | , | Engineering
Job description This position is for a Mechanical Engineer involved in supporting, developing, and improving microelectronics manufacturing processes to optimize Quality, On-Time Delivery, and Cost with an emphasis on Safety. Implementation of Lean M
Career Center | Hong Kong, Hong Kong | Engineering,Production,Research and Development
Area of expertise:- Conductive adhesive packaging esp Anisotropic conductive Ahesives, Flexible substrates,Lead free soldering.
Career Center | , | Engineering,Production,Quality Control,Research and Development
WORK EXPERIENCE Hutchinson Technology Incorporated, MN Feb.2006-Present Process Development Engineering Co-op �Study of voids generation in solder ball bonded Cu substrate with Ni/Au metallization. �Diffusion & Intermetallic growth study in sold
Imagineering, Inc. | https://www.pcbnet.com/blog/pcb-substrate/
. Selecting the right substrate material is crucial for the outcome and success of a high-quality PCB project. PCB substrates are created in a way that has often been compared to a sandwich
GPD Global | https://www.gpd-global.com/co_website/pdf/dispense/ClearVu-Vision.pdf
% 19 0.74803 100% 14 0.55118 Depth of Field at Zoom Levels The Programmable Zoom and Focus camera allows the vision system to accurately align multi-level substrates and substrates with very small fiducials. ClearVu™
