Manufactures a wide range of environmental test solutions capable of temperature and humidity cycling, thermal shock, production stress screening, accelerated stress testing, combined environment testing, controlled humidity exposure.
Industry Directory | Manufacturer
Founded in 1986, Zymet is a manufacturer of adhesives and encapsulants used in electronics and microelectronics assembly.
Eliminate Body Stress with Versatile CF-8 GPD's CF-8 eliminates component body stress. Versatility is the key word for the CF-8. Simple tooling changes make short or long run production jobs quick and easy. Capabilities Meets exacting military s
If you have boards requiring high tolerance mechanical dimension or odd shapes that traditional depaneling methods cannot handle. BEST Inc. provides laser depaneling services for printed circuit board manufacturers as well as EMS and OEMs. BEST’s nu
Used SMT Equipment | Pick and Place/Feeders
Panasonic placement machine cm212 features one: Achieved a maximum of 54,000 CPH (0.067s/pcs) Actual efficiency 38,000 CPH (0.098s/pcs) Substrate transport time…3.6 s (～substrate X=215㎜)
Used SMT Equipment | Depanelizers / Routers
Key Features Solution for stress free depanelization Fixture-based highly efficient dust vacuum system Clean and precise depanelization for densely populated PCBs Advanced image-processing software offers point-and-click operation fo
Industry News | 2024-04-06 00:43:25.0
Live demos at IPC APEX Expo 2024 – Booth 1504 – April 9-11, 2024, Anaheim, CA GRAND JUNCTION, CO USA -- April 2024 -- GPD Global – manufacturer of precision fluid dispensing systems for high-volume 24/7, low-volume/high-mix, and R&D production – will exhibit in Booth 1504 at IPC APEX EXPO 2024 on April 9-11 in the Anaheim Convention Center, CA.
Industry News | 2019-01-09 21:58:38.0
GPD Global will exhibit at IPC APEX EXPO 2019. Stop by Booth 2915 to see live demonstrations of machines and equipment. Experts will be there to discuss your production needs. Whether your project requires a pump for retrofitting or a fully automated dispense system, conformal coating, or component preparation, we have a solution for you.
Technical Library | 2023-01-17 17:12:33.0
Reflowed indium metal has for decades been the standard for solder thermal interface materials (solder TIMs or sTIMs) in most high-performance computing (HPC) TIM1 applications. The IEEE Heterogeneous Integration Thermal roadmap states that new thermal interface materials solutions must provide a path to the successful application of increased total-package die areas up to 100cm2. While GPU architectures are relatively isothermal during usage, CPU hotspots in complex heterogeneously-integrated modules will need to be able to handle heat flux hotspots up to 1000W/cm2 within the next two years. Indium and its alloys are used as reflowed solder thermal interface materials in both CPU and GPU "die to lid/heat spreader" (TIM1) applications. Their high bulk thermal conductivity and proven long-term reliability suit them well for extreme thermomechanical stresses. Voiding is the most important failure mode and has been studied by x-ray. The effects of surface pretreatment, pressure during reflow, solder flux type/fluxless processing, and preform design parameters, such as alloy type, are also examined. The paper includes data on both vacuum and pressure (autoclave) reflow of sTIMs, which is becoming necessary to meet upcoming requirements for ultralow voiding in some instances.
Technical Library | 2023-08-16 18:20:44.0
One of our defense customers planned to dispense underfill material for small and large die, using Hysol FP4545FC epoxy encapsulant. This process dissipates stress on solder joints and prevents cracking and fracturing between the bottom of the die and the surface of the substrate.
Eliminate Body Stress with Versatile CF-8 GPD's CF-8 eliminates component body stress. Versatility is the key word for the CF-8. Simple tooling changes make short or long run production jobs quick and easy. Capabilities Meets exacting military s
Training Courses | | | ESD Control Training Courses
Browse training and certification programs for electrostatic discharge (ESD) control in electronics assembly.
Training Courses | | | Other Courses
Other courses related to electronics manufacturing and assembly
Events Calendar | Mon Sep 14 18:30:00 UTC 2020 - Mon Sep 14 18:30:00 UTC 2020 | ,
Multitasking Makes You Stupid
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Webinar: Effective Strategies to Sharpen Your Focus and Concentration
Career Center | Detroit Metro area, Michigan USA | Engineering,Maintenance,Research and Development,Technical Support
Engineers Wanted for immediate and rare opportunities. Desired Characteristics 4 year Engineering degree or active Engineering students Attention to detail and Due Diligence centered Professional work ethics Effective communicat
Career Center | Detroit Metro area, Michigan USA | Engineering,Maintenance,Production,Technical Support
Technicians from entry level to senior level pro's. Prefer experience with one or more of the following OEM Equipment brands. Universal Instruments Speedprint Europlacer SMT (of Germany) Reflow Ovens Sanyo Panasonic DEK
Career Center | , Abu Dhabi | Engineering,Management,Production,Sales/Marketing
• Strong technical leadership and decision-making skills; strong verbal and written communication skills to provide clear, crisp direction for key issue resolution; and good team skills to facilitate cross-functional cross -site team effectiveness.
Career Center | KARACHI, PAKISTAN Pakistan | Engineering,Quality Control
� Six years experience in PCB (printed circuit board) designing using the most advanced design softwares. � Have designed complex PCBs for microchip manufacturing giants in the silicon valley mainly, Intel, IBM, AMD, Motorola, NEC, DEC, IDT, Texas In
Modelling of Thermal Stresses in Printed Circuit Boards Modelling of Thermal Stresses in Printed Circuit Boards Results of FEM modelling of thermal stress analysis in printed circuit boards are given in the article. It is shown that thermal
ASCEN Technology | https://www.ascen.ltd/Video_Channel/PCB_depaneling_machine/1067.html
PCB depaneling machine with parallel cut separation has less stress on PCB board-PCB magazine loader,PCB turn conveyor,pcb conformal coating machine,PCB router,PCB depaneling machine,pcb buffer
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/adhesive-dispensing-systems/products/bulk-delivery-systems?con=t&page=3
Adhesive Dispensing Systems Drum melters protect bonding characteristics and thermal stress in adhesives, sealants and butyls LA 320 Liquid Adhesive Diaphragm Pumps Data Sheet Adhesive Dispensing
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