Industry Directory | Manufacturer
Reflow ovens for automated SMT PCB assembly, specializing in lead free processing and nitrogen reflow. The best convection reflow ovens on the market.
Industry Directory | Consultant / Service Provider / Equipment Dealer / Broker / Auctions / Manufacturer / Manufacturer's Representative
Main Products: 1. Original new and Original Used SMT/AI Spare Parts. 2. SMT Equipments And Related Machine( Loader/Unloader,SMT Calibration, SMT Feeder Carts,Conveyer etc.) 3. Maintenace and Repair Service
New Equipment | Curing Equipment
A Pressure Cure Oven (PCO), or Autoclave, is used to minimize voiding and increase adhesion strength for bonding processes typically used in die attach and underfill applications. PCO pressurizes air into a rigid vessel and heats & cools with
Proven Peel Back Force Measurement Supplying consistent SMT carrier packaging is critical for customers using SMT pick-and-place machines. Nothing will stop a production line faster than carrier cover tape that doesn’t peel back properly. The proble
Used SMT Equipment | In-Circuit Testers
Fujikura FSM-40PM To keep up with the development of DWDM optical communication devices, we developed the FSM40PM for splicing of PM fibers. The FSM-40PM splices dissimilar fiber combinations, especially Erbium-doped fiber to single-mode fiber us
Used SMT Equipment | General Purpose Test & Measurement
The Aeroflex 6843 spectrum analyzer is a wide band 20GHz sensitive receiver. It works on the principle of "super-heterodyne receiver" to convert higher frequencies (normally ranging up to several 10s of GHz) to measurable quantities. The received fre
Industry News | 2013-05-21 22:12:09.0
Based on its recent analysis of the surface mount technology (SMT) reflow soldering equipment market, Frost & Sullivan recognizes Heller Industries, Inc. with the 2013 Global Frost & Sullivan Award for Market Share Leadership.
Industry News | 2023-10-18 17:43:18.0
HELLER's High UPH Vacuum Reflow Oven clinched the coveted "Step-by-Step Excellence Awards" - Innovation Award owing to its industry-leading product strength and outstanding performance.
Technical Library | 2023-01-17 17:27:13.0
Reflow profile has significant impact on solder joint performance because it influences wetting and microstructure of the solder joint. The degree of wetting, the microstructure (in particular the intermetallic layer), and the inherent strength of the solder all factor into the reliability of the solder joint. This paper presents experimental results on the effect of reflow profile on both 63%Sn 37%Pb (SnPb) and 96.5%Sn 3.0%Ag 0.5%Cu (SAC 305) solder joint shear force. Specifically, the effect of the reflow peak temperature and time above solder liquidus temperature are studied. Nine reflow profiles for SAC 305 and nine reflow profiles for SnPb have been developed with three levels of peak temperature (230 o C, 240 o C, and 250 o C for SAC 305; and 195 o C, 205 o C, and 215 o C for SnPb) and three levels of time above solder liquidus temperature (30 sec., 60 sec., and 90 sec.). The shear force data of four different sizes of chip resistors (1206, 0805, 0603, and 0402) are compared across the different profiles. The shear force of the resistors is measured at time 0 (right after assembly). The fracture surfaces have been studied using a scanning electron microscopy (SEM) with energy dispersive spectroscopy (EDS)
Technical Library | 2022-01-26 15:22:33.0
Reliability of conformal coatings used to mitigate tin whisker growth depends on their ability to contain tin whiskers. Two key material properties required to assess the reliability of a polyurethane coating are documented experimentally: adhesion strength and puncture strength. A modified blister test using a predefined blister area is employed to assess the adhesion strength and a puncture test is employed to evaluate the puncture strength of the coating. After measuring the properties at time zero, the coatings are subjected to accelerated testing conditions (high temperature/humidity storage and temperature cycling) and the degradations of the coating properties are documented.
General curing, die attach curing, underfill curing, film & tape bonding, wafer laminating.
Proven Peel Back Force Measurement Supplying consistent SMT carrier packaging is critical for customers using SMT pick-and-place machines. Nothing will stop a production line faster than carrier cover tape that doesn’t peel back properly. The proble
Events Calendar | Mon Apr 05 18:30:00 UTC 2021 - Mon Apr 05 18:30:00 UTC 2021 | ,
Capital Chapter Webinar: Next Gen Lead Free Solders for High Reliability & SMT Yield improvement
Events Calendar | Mon Mar 22 18:30:00 UTC 2021 - Wed Mar 24 18:30:00 UTC 2021 | Novi, Michigan USA
Adhesives & Bonding Expo
Career Center | , Sant Julia de Loria Malaysia | Management,Production,Sales/Marketing
Global CEM Has opportunity for US based sales executive to work on an Ex-Pat package in Asia for minimum of 2 year committment. This opportunity allows you to gain international sales experience, take advantage of tax free income while traveling the
Career Center | , Washington USA | Engineering,Management,Sales/Marketing
Do yor sales abilities over sell your current EMS employer? Are you tired of bringing in millions of dollars of potential new business, only to find out your company cannot close the deals or doesn't have the capacity to handle your clients? If you
Career Center | , Texas USA | Management
A goal oriented individual with eight years experience in PCBA Manufacturing. Major strengths are within leadership, manufacturing operations and training.
Career Center | chennai, tamil nadu India | Engineering,Production,Research and Development
A self-starting, analytical Electronics Engineer with over 9 years of experience in the High Volume, High Mix Electronics Industry. Principal strengths include Quality Assurance, Process Improvement and exceptional Problem Solving combined with exper
SMTnet Express July 11, 2013, Subscribers: 26149, Members: Companies: 13418, Users: 34911 Effect of BGA Reballing and its Influence on Ball Shear Strength by S. Manian Ramkumar Ph.D., Andrew J. Daya, Daniel B. Lewanda; Rochester Institute
Strength of Lead-free BGA Spheres in High Speed Loading Strength of Lead-free BGA Spheres in High Speed Loading Concern about the failure of lead-free BGA packages when portable devices such as cell phones are accidentally dropped and a general
| https://www.eptac.com/ask/copper-elongation-and-tensile-strength-requirements/
Copper Elongation and Tensile Strength Requirements - EPTAC - Train. Work Smarter. Succeed Looking for solder training standards, manuals, kits, and more
| https://www.smtfactory.com/I-C-T-is-always-Keeping-Improving-the-Comprehensive-Strength-id46753977.html
I.C.T is always Keeping Improving the Comprehensive Strength - I.C.T SMT Machine English Bahasa indonesia Сербия Česky Dansk Deutsch Español
