ZMD820 Standard Online AOI Inspection solution Feature ▶Flexible/multi-purpose AOI. ▶Vector analysis algorithm to achieve the best detection capability. ▶German brand 5 million pixel industrial camera. ▶The whole board is matched with multiple detec
New Equipment | Test Equipment
IN-CIRCUIT TESTER PMP-818S IN-CIRCUIT TESTER PMP-818S What does an in-circuit tester do? In-circuit test performs a “schematic verification” by testing individual components of a printed circuit board (PCBA) one at a time by comparison against a s
Used SMT Equipment | SPI / Solder Paste Inspection
Solder paste thickness detector Measurement software: MC-110-2.5D video observation, image storage, thickness measurement, data recording, background light, laser brightness control, area (square Shape, irregular polygon, circle) / volume / spacin
Used SMT Equipment | SPI / Solder Paste Inspection
KOH YONG/SPI KY8030 2XL MACHINE KY8030-2XL MC-110-2.5D video observation, image storage, thickness measurement, data recording, background light, laser brightness control, area (square, irregular polygon, circle)/volume/spacing (X, Y axis)/angle
Industry News | 2003-04-23 08:21:34.0
Rohm has a new series of ultrasmall high-brightness side-emitting chip LEDs that use built in reflectors and lenses to deliver optimum luminous intensity from minimal PCB footprint and power drain.
Industry News | 2015-01-09 11:11:22.0
BEST solder training and certification vehicle now outfitted with PCB "skin".
Technical Library | 2009-06-11 18:28:24.0
XLamp LEDs lead the solid-state lighting industry in brightness while providing a reflow-solderable design that is optimized for ease of use and thermal management. Lighting applications featuring XLamp LEDs maximize light output and increase design flexibility, while minimizing environmental impact. This application note serves as a guide to understanding thermal management of XLamp LEDs and minimizing the effects of elevated junction temperatures.
Technical Library | 2023-02-13 19:23:18.0
Spontaneously forming tin whiskers, which emerge unpredictably from pure tin surfaces, have regained prevalence as a topic within the electronics research community. This has resulted from the ROHS-driven conversion to "lead-free" solderable finish processes. Intrinsic stresses (and/or gradients) in plated films are considered to be a primary driving force behind the growth of tin whiskers. This paper compares the formation of tin whiskers on nanocrystalline and conventional polycrystalline copper deposits. Nanocrystalline copper under-metal deposits were investigated, in terms of their ability to mitigate whisker formation, because of their fine grain size and reduced film stress. Pure tin films were deposited using matte and bright electroplating, electroless plating, and electron beam evaporation. The samples were then subjected to thermal cycling conditions in order to expedite whisker growth. The resultant surface morphologies and whisker formations were evaluated.
IN-CIRCUIT TESTER PMP-818S IN-CIRCUIT TESTER PMP-818S What does an in-circuit tester do? In-circuit test performs a “schematic verification” by testing individual components of a printed circuit board (PCBA) one at a time by comparison against a s
https://www.ascen.ltd/Products/Solder_paste_printer/513.html full auto PCB screen printer and SMT solder paste printing machine with Image and optical system,It is a very accurate fully automatic SMT stencil printer.automatic PCB screen printer main
SMTnet Express: Here's What Happened On SMTnet This Week -- November 27, 2025 █ Electronics Manufacturing Technical Articles Sn-3.0Ag-0.5Cu/Sn-58Bi composite solder joint assembled using a low-temperature reflow process for PoP technology
ASCEN Technology | https://www.ascen.ltd/Products/Solder_paste_printer/394.html
Auto SMT Solder Paste Screen Printer-PCB magazine loader,PCB turn conveyor,pcb conformal coating machine,PCB router,PCB depaneling machine,pcb buffer conveyor from ASCEN technology Welcome to visit ASCEN | | | | | | | Cart
Surface Mount Technology Association (SMTA) | https://www.smta.org/iceet/2019_ICEET_Program.pdf
Brightness LED Application Jie Geng, Ph.D., Indium Corporation Session 1: Solder Materials Chair: Jason Keeping, P.Eng., Celestica, Inc. Co-Chair: Jason Rogers, M.G. Chemicals REGISTRATION OPENS Seika Machinery, Inc
