Industry News: sac305 sac405 (28)

SHENMAO Exhibits at SEMICON WEST July 11-13, 2017 Booth # 5716 Introduces New Low Residue Liquid Flux SMF-B51

Industry News | 2017-07-06 09:53:39.0

SHENMAO Technology introduces New Generation Ultra Low Residue Liquid Flux SMF-B51 with superior spray uniformity, excellent soldering performance and a wide process window for Chip Scale and Fan Out Wafer Level Packaging.

Shenmao Technology Inc.

SHENMAO Exhibits at IMAPS System in Package June 27-28, 2017 Introducing 3 New Semiconductor Packaging Fluxes

Industry News | 2017-06-25 20:33:39.0

SHENMAO Technology, Inc. introduces New Generation Ultra Tacky Flux SMF-WC52 applied in the Flip Chip dipping process. Its high tacky property keeps Chip in place during reflow for excellent soldering performance, while creating outstanding solder joint strength.

Shenmao Technology Inc.

Technical Library: sac305 sac405 (2)

The Great SAC Debate: Comparing The Reliability Of SAC305 And SAC405 Solders In A Variety Of Applications

Technical Library | 2021-09-08 14:23:27.0

Although the electronics industry has largely settled on the use of SAC alloys for the assembly of the majority of lead free products, debate continues to exist over which SAC alloy – SAC305 (Sn3.0Ag0.5Cu) or SAC405 (Sn3.8Ag0.8Cu) – to use. The North American industry generally favours SAC405, while the Asian industry favours SAC305. SAC305 has the significant benefit of being less expensive than SAC405 owing to its lower silver content. However, there are lingering questions about whether the reliability of SAC305 is comparable to that of SAC405. Recent studies have concluded that no significant difference exists, but many potential applications were not studied. This paper compares the results of reliability testing of SAC305 and SAC405 in three different cases on a test vehicle representative of a mid-complexity server-type product which included a range of component types from CBGAs to discrete resistors.

Celestica Corporation

Effect of BGA Reballing and its Influence on Ball Shear Strength

Technical Library | 2013-07-11 15:22:40.0

This research paper will focus on the effect of various parameters that are used to reball a BGA and their effect on the overall shear strength. Factors that will be looked at include the type of BGA (SAC305 or 63Sn/37Pb), the alloy used to reball (SAC405 or 63Sn/37Pb), the type of flux used (Water Soluble or No Clean), and the environment in which reballing takes place (Nitrogen or Ambient).

MARTIN (a Finetech company)

Express Newsletter: sac305 sac405 (123)

SMTnet Express - January 5, 2023

America, especially Sn3.0Ag0.5Cu (SAC305), the

SMTnet Express - September 9, 2021

be an optimal alloying addition in lead-free SAC (


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