Motor-driven MDS-508-500/509-500 separates v-scored PCBs without stress to boards, components or solder joints. It is suited for medium to high-volume production. Cut length is fully programmable; programmed length is displayed on an LED readout. MD
This oven is used for electron production and maintain of SMT technique. The product adopts the far-infrared heating components and excellent sense temperature materials. Through the precise control of the microcomputer, make the temperature control
Industry News | 2018-10-18 08:17:09.0
How to Prevent Solder Joint Voiding and Cold Solder Defects during the SMT Reflow Process
Industry News | 2011-08-18 21:23:09.0
For an industry that is constantly advancing, the technical conference at IPC Midwest Conference & Exhibition on September 21–22, in Schaumburg, Ill., will feature five sessions offering the latest research, methodologies and insights from industry experts to address critical challenges of manufacturing defect-free, quality electronics.
Technical Library | 2007-08-16 13:34:31.0
While experienced inspectors may be able to determine the aesthetic differences between a lead-free PCB assembly and a tin-lead version, one cannot rely on the "experienced eye". "Less wetting out to the pad edges" (Figure A) and "graininess and lack of shininess of the solder joint" (Figure B) are typical comments about some lead-free solder joints. However, in cases where a Nitrogen atmosphere was present during the reflow of the solder joint (Figure C), there will be little visual differences between the lead free alloys and their tin-lead counterparts.
Quick Overview: Motor-driven MDS-508-500/509-500 separates v-scored PCBs without stress to boards, components or solder joints. it is suited for medium to high-volume production,available with 460 mm or 600 mm (option) maximum cutting length. Cut le
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resource-center/solder-glossary-of-terms
temperature joints. T Tackiness Ability of solder paste to hold surface-mount components in place after placement. Tensile Strength Characteristic of a material that describes its resistance to fracture when the material is under tension. Through hole A
| https://www.eptac.com/blog/5-common-solder-mistakes-and-how-to-resolve-them
. 4. Cold Solder Joint A cold solder joint occurs when the solder does not melt completely. A result of insufficient heat, cold joints are often characterized by being rigid, rough, and uneven in appearance
