Industry Directory | Association / Non-Profit
The EOS/ESD Association is a professional voluntary association dedicated to advancing the theory and practice of electrostatic discharge (ESD) avoidance.
Industry Directory | Manufacturer
We have ESD durostone, ESD ricocel,ESD FR4/G10,ESD bakelite for solder pallet,jigs and fixtures.
New Equipment | Solder Paste Stencils
DESEN Classic 1008 SPECIFICATIONS Process Parameters Specification Machine Alignment Capability ≥2 Cpk@±25μm@,6σ Process Alignment Capability ≥2 Cpk@±10μm@,6σ Cycle Time 7s Maximum
New Equipment | Solder Paste Stencils
DESEN Hito SPECIFICATIONS Process Parameters Specification Machine Alignment Capability ≥2 Cpk@±18μm@,6σ Process Alignment Capability ≥2 Cpk@±8μm@,6σ Cycle Time 7s Maximum Print Area 400mm
Electronics Forum | Tue Dec 14 02:19:03 EST 2010 | sachu_70
With lower Humidity levels, we expose to greater risk towards ESD related failures seen on components. Pl. ensure to have your entire work area fully guarded against ESD and maintain proper material handling instructions across the entire flowline un
Electronics Forum | Thu Feb 16 18:14:45 EST 2006 | Geo E
We have just purchased a humidity logger and I need to know what the relitive humidity should be in a SMT production area. The Room is enclosed approx. 60ft by 30ft using ESD Floor tile. 3 machines are in the room as well as some Thru hole machines.
Industry News | 2013-07-17 19:05:42.0
IPC — Association Connecting Electronics Industries® will host IPC APEX India™ on 26–29 August 2013 at the NIMHANS Convention Centre in Bangalore, India.
Industry News | 2013-07-19 11:33:18.0
IPC — Association Connecting Electronics Industries® will host IPC APEX India™ on 26–29 August 2013 at the NIMHANS Convention Centre in Bangalore, India.
Parts & Supplies | SMT Equipment
contact person:banny chen mail:zksale@hysmt.cn skype:miayuan8 40000411 Y-AXIS SENSOR BR ASSY 40000413 FEEDER FLOAT_SENS ASSY 40000414 FEEDER_SENS ASSY 40000875 WAIT_SENSOR_BRACKET 40000908 IN SENSOR ASM 40000912 SENSOR ADJUST SPRIG 4000
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Parts & Supplies | SMT Equipment
contact person:banny chen mail:zksale@hysmt.cn skype:miayuan8 40000411 Y-AXIS SENSOR BR ASSY 40000413 FEEDER FLOAT_SENS ASSY 40000414 FEEDER_SENS ASSY 40000875 WAIT_SENSOR_BRACKET 40000908 IN SENSOR ASM 40000912 SENSOR ADJUST SPRIG 4000
Technical Library | 2011-01-13 17:37:55.0
The tin whisker failures investigated in this paper were found on functional RoHS-compliant hardware. The samples were not conformal coated. This paper will document the conditions associated with the whisker formation under the following conditions; tin
Technical Library | 2014-05-08 16:34:16.0
Bare die mounting on multi-device substrates has been in use in the microelectronics industry since the 1960s. The aerospace industry’s hybrid modules and IBM’s Solid Logic Technology were early implementations that were developed in the 1960’s. The technologies progressed on a steady level until the mid 1990’s when, with the advent of BGA packaging and chip scale packages, the microelectronics industry started a wholesale move to area array packaging. This paper outlines the challenges for both traditional wire-bond die attached to a printed wiring board (pwb), to the more recent applications of bumped die attached to a high performance substrate.
Events Calendar | Thu Jun 08 00:00:00 EDT 2023 - Thu Jun 08 00:00:00 EDT 2023 | ,
SMTA Workforce Development Webinar: PCB Design Courses and Careers in PCB Design
Career Center | Gurgaon, India | Engineering,Management,Production,Purchasing,Quality Control
1. Quality Function Management • Ensure timely inspection at incoming, in-process & outgoing stage. • Non-conformance review & reporting. • Decision making - Right disposal of Non-conforming material. • Determination of Vendor Quality rating (VQR
Electrostatic Discharge (ESD) - Sources of Electrostatic Charges in Production Line (SMT) Electrostatic Discharge (ESD) - Sources of Electrostatic Charges in Production Line (SMT) The number of failures caused by electrostatic discharges (ESD
SMTnet Express June 20, 2013, Subscribers: 26136, Members: Companies: 13402, Users: 34820 Implementation of Effective ESD Robust Designs by: Industry Council on ESD Target Levels While IC level ESD design and the necessary protection levels
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/industries/pulp-paper-and-paperboard-converting?con=t&page=3
converting in automobiles, carpets, home furnishing, fiber, filaments, more... Conformal Coating Process Characterization Considerations Nordson ASYMTEK Selective coating coats specific areas
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/journal-review-process.cfm
. Paper Format/Structure Requirements General Formatting (Download a format template here) All manuscripts should be formatted in Times New Roman size 12 font, as a single column, double-spaced, Microsoft Word Document
