Nordson Dage XD7600NT500 X-Ray Inspection System with X-Plane Analysis - Datest was one of the first users of the X-Plane algorithm. We now have 3 years of experience using X-Plane. It is a very powerful tool for detecting head-in-pillow (HiP) de
New Equipment | Education/Training
Now updated to Revision F of the latest IPC-A-610F and J-STD-001F – the IPC Training & Reference Guide illustrates critical acceptance criteria for the evaluation of through-hole solder connections. With 30 pages and a compact size at 5.5 x 8.5 inch
Electronics Forum | Wed Oct 27 19:50:59 EDT 1999 | chris
Hi What is the possible cause of non-wetting of solder paste to the gold land pad. What we observed in the surface of the non-wet pad is an organic FM, and using FTIR we found out that it is a flux. It is possible that the cause of non-wetting is
Electronics Forum | Wed Mar 30 08:06:17 EST 2005 | davef
Considerations are: * If the nonwetting is component lot specific, the could be solderability issues with that lot. * If the nonwetting is is a broader based component issue, the solderability protection on the component may require a different reflo
Industry News | 2013-07-22 09:54:27.0
GPD Global has introduced its new NCM5000 dispense pump for easy jetting. With only two wetted parts and no seals or springs to replace or adjust, field operation is simple.
Industry News | 2018-10-18 08:21:10.0
How to Prevent Non-Wetting Defect during the SMT Reflow Process
Technical Library | 2014-03-06 19:04:07.0
Over the last few years, there has been an increase in the rate of Head-in-Pillow component soldering defects which interrupts the merger of the BGA/CSP component solder spheres with the molten solder paste during reflow. The issue has occurred across a broad segment of industries including consumer, telecom and military. There are many reasons for this issue such as warpage issues of the component or board, ball co-planarity issues for BGA/CSP components and non-wetting of the component based on contamination or excessive oxidation of the component coating. The issue has been found to occur not only on lead-free soldered assemblies where the increased soldering temperatures may give rise to increase component/board warpage but also on tin-lead soldered assemblies.
#Xray#Inspection#SEC Nano-focus Tube of 200 nano resolution which is specialized for sub-micron defects of Semiconductor Packaging, Wafer Level Packaging(WLP). -Non-destructive Analysis System -High-Resolution Image with Dual Type CTs -Application
ALPHA® Preforms with solder paste adds solder volume.
