Industry Directory | Manufacturer
Flason is high-tech enterprise focusing on SMT research and development,building new advanced solutions in SMT Assembly machines, like reflow oven, wave soldering machine, pick and place machine, AOI,SPI,PCB conveyor etc.
Industry Directory | Consultant / Service Provider / Manufacturer
Since 1992 Contract Manufacturer (Circuit Boards) Service,Reliability,Quality. ISO certified Controlled Goods Certified IPC standards Engineering Certified CID & CID+ National & International customer base Totally Service Oriented
New Equipment | Assembly Services
Hitechpcb is an expert PCB manufacturing & assembly company that proudly supplies PCB assembly solutions to businesses of all sizes in China. Our industry-leading PCB assembly processes create PCBs of the highest quality. Our expert team is made up o
http://www.flason-smt.com/product/SMT-Online-AOI-Machine.html SMT Online AOI Machine ZW 810 Inspection Component: 0201 chip PCB size::25x25-480*330mm Dimension:900*950*1600 mm Weight: 650kg Product description: SMT Online AOI Machine ZW 810, I
Industry News | 2016-10-25 09:47:33.0
Learn about SMT assembly from SME Phil Zarrow in Chicago
Industry News | 2003-04-07 10:16:38.0
Portable Products and Optoelectronic Applications Still Hold Promise for Growth
Technical Library | 2020-10-27 02:07:31.0
For companies that choose to take the Pb-free exemption under the European Union's RoHS Directive and continue to manufacture tin-lead (Sn-Pb) electronic products, there is a growing concern about the lack of Sn-Pb ball grid array (BGA) components. Many companies are compelled to use the Pb-free Sn-Ag-Cu (SAC) BGA components in a Sn-Pb process, for which the assembly process and solder joint reliability have not yet been fully characterized. A careful experimental investigation was undertaken to evaluate the reliability of solder joints of SAC BGA components formed using Sn-Pb solder paste. This evaluation specifically looked at the impact of package size, solder ball volume, printed circuit board (PCB) surface finish, time above liquidus and peak temperature on reliability. Four different BGA package sizes (ranging from 8 to 45 mm2) were selected with ball-to-ball pitch size ranging from 0.5mm to 1.27mm. Two different PCB finishes were used: electroless nickel immersion gold (ENIG) and organic solderability preservative (OSP) on copper. Four different profiles were developed with the maximum peak temperatures of 210oC and 215oC and time above liquidus ranging from 60 to 120 seconds using Sn-Pb paste. One profile was generated for a lead-free control. A total of 60 boards were assembled. Some of the boards were subjected to an as assembled analysis while others were subjected to an accelerated thermal cycling (ATC) test in the temperature range of -40oC to 125oC for a maximum of 3500 cycles in accordance with IPC 9701A standard. Weibull plots were created and failure analysis performed. Analysis of as-assembled solder joints revealed that for a time above liquidus of 120 seconds and below, the degree of mixing between the BGA SAC ball alloy and the Sn-Pb solder paste was less than 100 percent for packages with a ball pitch of 0.8mm or greater. Depending on package size, the peak reflow temperature was observed to have a significant impact on the solder joint microstructural homogeneity. The influence of reflow process parameters on solder joint reliability was clearly manifested in the Weibull plots. This paper provides a discussion of the impact of various profiles' characteristics on the extent of mixing between SAC and Sn-Pb solder alloys and the associated thermal cyclic fatigue performance.
Hitechpcb is an expert PCB manufacturing & assembly company that proudly supplies PCB assembly solutions to businesses of all sizes in China. Our industry-leading PCB assembly processes create PCBs of the highest quality. Our expert team is made up o
NanoSlic™ Gold is our top of the line spray on coating applied to our UltraSlic™ solder paste stencil, which gives previously unseen performance benefits in transfer efficiency. The NanoSlic™ Gold coating also gives the benefits of improved under-ste
Career Center | Rocklin, California USA | Production
General Overview of Position With this new position Parallax aims to improve our USA manufacturing throughput in a time when most companies normally only send work offshore. This raises the standard for requiring efficient use of our Pick and Place
SMTnet Express, March 16, 2017, Subscribers: 30,295, Companies: 15,177, Users: 42,073 Best Practices for RoHS Compliance in support of CE Marking Randy Flinders; GreenSoft Technology, Inc. In 2012, The European Directive on Reduction of Hazardous
SMTnet Express, September 5, 2019, Subscribers: 32,208, Companies: 10,873, Users: 25,081 Full Material Declarations: Removing Barriers to Environmental Data Reporting Credits: TE Connectivity Since the European Directives, RoHS and REACH, entered
GPD Global | https://www.gpd-global.com/pdf/RoHS-II-Declaration-of-Compliance-GPD-Global-22240109.pdf
(“Restriction on the use of certain Hazardous Substances”), commonly known as “RoHS II,” this letter hereby declares that the following parts comply with the Directive
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