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Experienced PCB circuit board and laser SMT stencil maker. Focus on complex PCB making up to 30 layers. Please visit www.marvelpcb.com for more details
Electronics Forum | Mon Jun 08 13:26:59 EDT 1998 | D.Hammond
I work QA at an OEM in Alberta, Canada. I saw earlier posts on the smtnet regarding PCB haloing criteria. I am currently in a dispute with my PCB vendor over the acceptability of haloing (delamination) around plated through holes and vias on a lot of
Electronics Forum | Mon Jun 08 15:01:02 EDT 1998 | D.Lange
| I work QA at an OEM in Alberta, Canada. I saw earlier posts on the smtnet regarding PCB haloing criteria. I am currently in a dispute with my PCB vendor over the acceptability of haloing (delamination) around plated through holes and vias on a lot
Industry News | 2017-03-06 05:25:35.0
Many of the webinars we present every month are available from our online archive. The video recordings and a copy of the slides can be provided for you or why not organise an education session with members of your team in a conference room so you can also discuss the subject after the session to implement your process improvements
Technical Library | 2008-04-15 14:43:08.0
The increasing demands for miniaturization and better functionality of electronic components and devices have a significant effect on the requirements facing the printed circuit board (PCB) industry. PCB manufactures are driving for producing high density interconnect (HDI) boards at significantly reduced cost and reduced implementation time. The interconnection complexity of the PCB is still growing and today calls for 50/50 μm or 25/25 μm technology are real. Existing technologies are unable to offer acceptable solution. Recently the Laser Direct Imaging (LDI) technology is considered as an answer for these challenges.
Unipress - Institute of High Pressure Physics of the Polish Academy of Sciences
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/webinars.cfm
Jennie Hwang, Ph.D. $200.00 2015 Shining a Light on LED Technology Martine Simard-Normandin Free! 2015 Process Optimization and Defect Elimination for PCB Assembly Tim Jensen $200.00 2015 Thermal Events
| https://www.eptac.com/news/eptac-corporation-develops-a-trio-of-hands-on-ipc-a-620-programs-for-solder-crimp-and-cable-harness-assembly/
) different types of terminal connections commonly used in industry. Assembly and inspection for accept/reject criteria is based on both the IPC-A-620 and J-STD-001
Products, services, training & consulting for the assembly, rework & repair of electronic assemblies. BGA process experts. Manufacturers Rep, Distributor & Service Provider for Seamark/Zhuomao and Shuttle Star BGA Rework Stations.
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