Industry Directory | Manufacturer
X-Parts Way Technology Co., Limited was established by a team of highly specialized engineers with the aim to provide turnkey solutions for reliable EMS (Electronics Manufacturing Services) .
New Equipment | Education/Training
If you are looking at becoming a subject matter expert in IPC-6012 “Qualification and Performance Specification for Rigid Printed Boards” without the need to provide any IPC Certification to others, then this is the program for you. As a
New Equipment | Education/Training
If you are looking at becoming a subject matter expert in IPC-A-610, “The Acceptability of Electronic Assemblies” without the need to provide any IPC Certification to others, then this is the program for you. As a CSE – Certified S
Used SMT Equipment | Pick and Place/Feeders
Dear Customer, We have the machine as below for sales, Model: KE 2070 L Vintage: 2010 No Feeder Please contact us if you are interested. Regards Michael var LEO_HIGHLIGHTS_INFINITE_
Used SMT Equipment | Pick and Place/Feeders
Dear Customer, We have the following machine for sales, Model: KE 2080 L Vintage: 2010 No Feeder C/W Tray unit Please contact us if you are interested. Regards Michael var LEO
Industry News | 2020-04-02 14:42:58.0
Due to the ongoing COVID-19 pandemic, Blackfox is offering online IPC training and certification beginning in mid-April.
Industry News | 2020-05-27 15:54:35.0
Blackfox is opening its facilities to in-person training for the electronics manufacturing industry with a thorough and documented safety plan for all. If preferred, Blackfox is also offering online IPC training and certification in either English or Spanish from the comfort of your home or office.
Technical Library | 2021-07-20 20:02:29.0
During the manufacturing of printed circuit boards (PCBs) for a Flight Project, it was found that a European manufacturer was building its boards to a European standard that had no requirement for copper wrap on the vias. The amount of copper wrap that was measured on coupons from the panel containing the boards of interest was less than the amount specified in IPC-6012 Rev B, Class 3. To help determine the reliability and usability of the boards, three sets of tests and a simulation were run. The test results, along with results of simulation and destructive physical analysis, are presented in this paper. The first experiment involved subjecting coupons from the panels supplied by the European manufacturer to thermal cycling. After 17 000 cycles, the test was stopped with no failures. A second set of accelerated tests involved comparing the thermal fatigue life of test samples made from FR4 and polyimide with varying amounts of copper wrap. Again, the testing did not reveal any failures. The third test involved using interconnect stress test coupons with through-hole vias and blind vias that were subjected to elevated temperatures to accelerate fatigue failures. While there were failures, as expected, the failures were at barrel cracks. In addition to the experiments, this paper also discusses the results of finite-element analysis using simulation software that was used to model plated-through holes under thermal stress using a steady-state analysis, also showing the main failure mode was barrel cracking. The tests show that although copper wrap was sought as a better alternative to butt joints between barrel plating and copper foil layers, manufacturability remains challenging and attempts to meet the requirements often result in features that reduce the reliability of the boards. Experimental and simulation work discussed in this paper indicate that the standard requirements for copper wrap are not contributing to the overall board reliability, although it should be added that a design with a butt joint is going to be a higher risk than a reduced copper wrap design. The study further shows that procurement requirements for wrap plating thickness from Class 3 to Class 2 would pose little risk to reliability (minimum 5 μm/0.197 mil for all via types).Experimental results corroborated by modeling indicate that the stress maxima are internal to the barrels rather than at the wrap location. In fact, the existence of Cu wrap was determined to have no appreciable effect on reliability.
Technical Library | 2019-04-08 23:21:29.0
Climatest Symor® adopts molecular sieve to dry air, the whole system is controlled by microcomputer, when humidity is high, It will start to absorb moisture,when the humidity reach the pre-set value, it will stop absorbing, and then discharge the water to outside the cabinet by heating,again and again by automatic control. The most effective and environment-friendly moisture-absorbing desiccant is molecular sieve, molecular sieve is the microporous crystal material synthesized by silicon and aluminium oxide. In order to keep the crystal net discharge to be zero, atoms with cations are located in the crystal structure.and the cation used in these synthetic crystals is usually sodium. At present, there are two kinds of molecular sieves widely used in the dry box industry: Class A and Class X. Molecular sieves are synthesized, shaped and activated under strictly controlled production processes. The whole controlled sythesis process can ensure consistency of the three-dimensional pore size. 3A molecular sieve pore size is 3 angstroms, 4A molecular sieve pore size is 4 angstroms; 13X molecular sieve pore size is 8.5 angstroms. The working principle of molecular sieve: Molecular sieves adsorb molecules onto the crystal surface by physical attraction force. Since 95% surface area of the molecular sieve is within aperture,it needs to screen the adjacent molecules by different size. Only small size molecules can enter into the inner adsorption surface of the molecular sieve through the crystal aperture. This selective adsorption phenomenon is called molecular sieve effect. The molecular sieve adsorption capacity and charge density (polarity) are further related to the adsorbed molecules. The molecular sieves can further distinguish which of the mixed molecules can be adsorbed and determine to what extent the charge density can allow the molecules to be adsorbed onto the crystal. Water molecules are particularly small (2.6 angstroms), that belong to highly polar molecules (very strong positive and negative electron density), and are easily adsorbed by molecular sieves, even under very low moisture condition,once the water molecules are adsorbed,they will be firmly fixed on the crystal. The environment-friendly moisture absorption device is equipped with molecular sieve. When it’s absorbing, the memory alloy controller is in tensile state, and the spring is in contractive state,which just make the valve contact the outer baffle, this insulates the outside air from inside dry box air to achieve dehumidification purpose; and after molecular sieve absorbed moisture inside dry box and become saturated, the program will automatically control the memory alloy device to shrink it so that the valve reaches the inner baffle position. Meanwhile, due to the shrinkage of the memory alloy, the spring is stretched and the valve is pulled out of the outer baffle,so that the moisture in molecular sieve will be discharged into the outside. after the dehumidifying process finished, the program automatically control and reset the memory alloy and spring,to restart absorbing status.
FUJI High Performance NXT-H Hybrid Chip Mounter If you could not find any similar items you want, you may send some photos to us. because our catalog and website haven't included allof our products. Pick and place machine, SMT pick and place
Panasonic CM602 Pick and Place Machine If you could not find any similar items you want, you may send some photos to us. because our catalog and website haven't included allof our products. Pick and place machine, SMT pick and place m
Training Courses | | | IPC-6012 Trainer (CIT)
The Certified IPC-6012 Trainer (CIT) courses recognize individuals as qualified trainers in the area of design, fabrication and inspection of rigid printed boards and prepare them to deliver Certified IPC-6012 Specialist (CIS) training.
Training Courses | | | IPC-6012 Expert (CSE)
The IPC-6012 CSE program confirms that an individual has demonstrated the level of knowledge and understanding required to act as a subject matter expert for the IPC-6012 standard.
Career Center | Wylie, Texas USA | Engineering,Production,Quality Control
Candidate needed for source inspection to the requirements of Mil-P-55110 IPC 6011, class 1,2 and 3 IPC 6012, class 1,2 and 3, PWB-PWG, Exp. with PWA and soldering necessary.
Career Center | Anaheim, USA | Engineering
General Manager & VP, PG Drives Technology, Inc Company Outline PG Drives Inc is the North American sales, service and distribution subsidiary of PG Drives Ltd, a leading global designer and manufacturer of sophisticated electronic motor control s
Modern 2D / 3D X-Ray Inspection - Emphasis on BGA, QFN, 3D Packages, and Counterfeit Components Modern 2D / 3D X-Ray Inspection - Emphasis on BGA, QFN, 3D Packages, and Counterfeit Components With PCB complexity and density increasing and also
Heller 公司 | https://hellerindustries.com.cn/part/5748k/
5748K » Parts » 5748K 5748K : FUSE CLASS CC 3A (KTK-R-3) Part Name: FUSE CLASS CC 3A (KTK-R-3) Part #:5748K Contact Us About: FUSE CLASS CC 3A (KTK-R-3), 5748K Machine Tooth Sprocket E-Mail Us
ASCEN Technology | https://www.ascen.ltd/Products/custom_automatic_machine/pcb_cutting_mach/864.html
> Automation Industrial Custom > pcb cutting machine > > Show all PCB depaneling router Model: AS--3A Brand: ASCEN Delivery Time: 5-7day Desciption: PCB depaneling router is used to depanel
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