Industry Directory | Manufacturer
We are the UAE�s only leading Lighting Industry manufacturing Compact Fluorescent Lamps, Metal Halide Lamps (High Intensity Discharge Lamps), Halogen Lamps located in Dubai-a bustling metropolis on the shores of Arabian Gulf. Commissioned in 1994 as
Industry Directory | Manufacturer
Aoki Laboratories Ltd. is an ISO-9002 certified company specializes in manufacturing of Sn/Pb Bar Solder, Cored Wire and Paste.Environmental friendly products, such as: lead-free solder, no-clean non-halide solder flux, no-clean cored wire and Non-CFC cleaner, are compliance with ISO-14001 requirements.
New Equipment | Solder Materials
As the world's leading developer of advanced solder paste materials, Henkel delivers decades of technology and expertise for optimized process performance. With ground breaking new formulations to provide an easy transition to lead-free as well as pr
New Equipment | Solder Materials
Shenmao Technology offers a full line of Water Soluble Fluxes and Water Soluble Solder Paste for SMT and IC packaging applications. We provide halide-containing and halide-free fluxes for Tin/Lead as well as Lead-Free solder alloys. Our formulations,
Industry News | 2011-04-22 21:54:12.0
The Capital Chapter is announcing its next SMTA meeting to be held at APL, Johns Hopkins University, in Laurel MD on May 17, 2011 from 5pm-8pm.
Industry News | 2009-07-16 14:35:03.0
POWAY, CA — July 2009 — EasySpheres LLC features Kester’s 959T no-clean, non-corrosive, halide-free Flux Pen®.
Technical Library | 2023-02-13 18:56:42.0
This paper describes the results of an intensive whisker formation study on Pb-free assemblies with different levels of cleanliness. Thirteen types of as-received surface-mount and pin-through-hole components were cleaned and intentionally contaminated with solutions containing chloride, sulfate, bromide, and nitrate. Then the parts were assembled on double-sided boards that were also cleaned or intentionally contaminated with three fluxes having different halide contents. The assemblies were subjected to high-temperature/high-humidity testing (85_C/85% RH). Periodic examination found that contamination triggered whisker formation on both exposed tin and solder fillets. Whisker occurrence and parameters depending on the type and level of contamination are discussed. Cross-sections were used to assess the metallurgical aspects of whisker formation and the microstructural changes occurring during corrosion.
90% on area ratios of 0.50 and a stencil life >8 hours. H10’s powerful wetting characteristics eliminate NWO (HiP) defects and improve pad coverage on all surface finishes. H10 reduces voiding on BGA, BTC and LGA and offers enhanced electrochemical r
Discover the RH-2000 from Hirox! More information: - www.hirox-europe.com - www.hirox.com - www.hirox-usa.com
| https://pcbasupplies.com/wp-content/uploads/2023/10/S3X58-M650-7-solder-paste.pdf
*Measured by external institution Alloy composition (%) Melting point (℃) Particle size（μｍ) Viscosity (Pa・s) Flux content (%) Halide content (%) Flux type Product name Product specifications
