http://www.flason-smt.com/product/Hitachi-SIGMA-G5-Pick-and-Place-Machine.html Hitachi SIGMA G5 Pick and Place Machine Hitachi SIGMA G5 Pick and Place Machine Mounting Speed: 84500chip Placement range 1005 (0402) -32mmIC Placement accuracy: 0.
http://www.flason-smt.com/product/Hitachi-SIGMA-G5-Pick-and-Place-Machine.html Hitachi SIGMA G5 Pick and Place Machine Hitachi SIGMA G5 Pick and Place Machine Mounting Speed: 84500chip Placement range 1005 (0402) -32mmIC Placement accuracy: 0.
Used SMT Equipment | AOI / Automated Optical Inspection
Mirtec AOI MV-7XI FIVE CAMERA 2D/3D In-Line AOI System Exclusive OMNI-VISION® 2D/3D Inspection Technology Exclusive FIFTEEN MEGA PIXEL ISIS® Vision System 10 Micron / Precision TELECENTRIC COMPOUND LENS Advanced 3D DIGITAL MULTI-FREQUENCY
Used SMT Equipment | Pick and Place/Feeders
Mirtec AOI MV-7omni Description In-Line AOI Machine FIVE CAMERA 2D/3D In-Line AOI System Exclusive OMNI-VISION® 2D/3D Inspection Technology Exclusive FIFTEEN MEGA PIXEL ISIS® Vision System 10 Micron / Precision TELECENTRIC COMPOUND LENS Advanced 3D
Industry News | 2016-02-18 19:49:13.0
The best technical conference paper of IPC APEX EXPO® 2016 has been selected. Voted on through a ballot process by members of the IPC APEX EXPO Technical Program Committee, the paper authors will receive their awards during the opening keynote session on Tuesday, March 15.
Industry News | 2018-12-08 03:29:29.0
SMT Dictionary – Surface Mount Technology Acronym and Abbreviation
Technical Library | 2012-08-30 21:24:29.0
This paper provides definitions of the different voiding types encountered in Gull Wing solder joint geometries. It further provides corresponding reliability data that support some level of inclusion voiding in these solder joints and identifies the final criteria being applied for certain IBM Server applications. Such acceptance criteria can be applied using various available x-ray inspection techniques on a production or sample basis. The bulk of supporting data to date has been gathered through RoHS server exempt SnPb eutectic soldering operations but it is expected to provide a reasonable baseline for pending Pb-free solder applications.
Technical Library | 2011-06-09 20:28:30.0
QFN Description: A QFN package is a QUAD-FLAT-NO LEAD device. This package is small and lightweight and has no leads (unlike a gull wing or J-leaded device). QFN’s have a thermal pad (paddle) on the bottom side of the part that offers heat dissipation and
The IPC-7711 & 7721 Instructor course is built on a train-the-trainer model. Upon completion of the course, students will know the technical guidelines of IPC-7711 and 7721 and have demonstrated the proficiency necessary to perform rework and repair
The IPC-7711 & 7721 Instructor course is built on a train-the-trainer model. Upon completion of the course, students will know the technical guidelines of IPC-7711 and 7721 and have demonstrated the proficiency necessary to perform rework and repair
Training Courses | | | IPC-7711/IPC-7721 Expert (CSE)
The IPC-7711/IPC-7721 CSE program confirms that an individual has demonstrated the level of knowledge and understanding required to act as a subject matter expert for the IPC-7711/IPC-7721 standard.
Training Courses | ON DEMAND | | IPC-7711/7721 Trainer (CIT)
The Certified IPC-7711/7721 Trainer (CIT) courses recognize individuals as qualified trainers in the area of rework and repair of printed boards and electronic assemblies and prepares them to deliver Certified IPC-7711/7721 (CIS) training.
Inclusion Voiding in Gull Wing Solder Joints SMTnet Express August 30, 2012, Subscribers: 25432, Members: Companies: 8960, Users: 33565 Inclusion Voiding in Gull Wing Solder Joints First published in the 2012 IPC APEX EXPO technical conference
Blackfox Training Institute, LLC | https://www.blackfox.com/ipc-certification/ipc-specialist/ipc-77117721-cis-recertification/
. Operators will obtain the knowledge to: State the purpose, scope, schedule, and grading criteria of the re-certification course. State IPC policies that govern operation of 7711/7721 certification and re-certification program Demonstrate Through-Hole, J-lead, Gull-Wing, Fine Pitch, and Chip component rework and replacement
