New Equipment | Wave Soldering
http://www.flason-smt.com/product/SMT-wave-soldering-machine-for-pcb-production-line.html SMT wave soldering machine for PCB Manufacturing Weight: 1100KG Dimensions: 3300(L)*1400(W)*1560(H) spray fashion: SMC+ST 6 nozzle Heating zone Length: 1
New Equipment | Soldering - Other
Wave Soldering Machine SMT wave soldering machine for pcb production line Weight: 1100KG Dimensions: 3300(L)*1400(W)*1560(H) spray fashion: SMC+ST 6 nozzle Heating zone Length: 1600mm Product description: SMT wave soldering m
Industry News | 2013-08-15 20:58:22.0
Heller Industries announced today that they have entered into a joint development agreement with International Business Machines Corporation (NYSE: IBM), to collaborate on the development of fluxless mass reflow furnace equipment and process for high volume manufacturing. The fluxless process utilizes gas phase formic acid to replace standard fluxing agents, and eliminates the need for pre-reflow fluxing and post-reflow flux cleanup steps.
Industry News | 2017-09-16 02:29:39.0
Heller Industries has been awarded the 2017 Global Frost & Sullivan Company of the Year Award for its surface mount technology (SMT) soldering equipment that enables Industry 4.0. - the automation and data exchange in manufacturing technologies.
Technical Library | 2014-10-23 18:10:10.0
The functional reliability of electronic circuits determines the overall reliability of the product in which the final products are used. Market forces including more functionality in smaller components, no-clean lead-free solder technologies, competitive forces and automated assembly create process challenges. Cleanliness under the bottom terminations must be maintained in harsh environments. Residues under components can attract moisture and lead to leakage currents and the potential for electrochemical migration (...) The purpose of this research study is to evaluate innovative spray and soak methods for removing low residue flux residues and thoroughly rinsing under Bottom Termination and Leadless Components
Technical Library | 2022-12-19 18:59:51.0
Material and Process Characterization studies can be used to quantify the harmful effects that might arise from solder flux and other process residues left on external surfaces after soldering. Residues present on an electronic assembly can cause unwanted electrochemical reactions leading to intermittent performance and total failure. Components with terminations that extend underneath the package can trap flux residue. These bottom terminated components are flush with the bottom of the device and can have small solderable terminations located along the perimeter sides of the package. The clearance between power and ground render high electrical forces, which can propagate electrochemical interactions when exposed to atmospheric moisture (harsh environments). The purpose of this research is to predict and understand the functional performance of residues present under single row QFN component packages. The objective of the research study is to develop and collect a set of guidelines for understanding the relationship between ionic contamination and electrical performance of a BTC component when exposed to atmospheric moisture and the trade-offs between electrical, ionic contamination levels, and cleanliness. Utilizing the knowledge gained from undertaking the testing of QFN components and associated DOE, the team will establish a reference Test Suite and Test Spec for cleanliness.
SMTA International Electronics Exhibition Tuesday, September 29: 9am-5pm Wednesday, September 30: 9am-4pm Donald Stephens Convention Center Rosemont, IL See More Equipment & Technology Than Ever Before! Many of the 160 exhibiting companies will bri
This is an indepth video showing you how to rework a BGA using the PDR IR-E3 with CCTV/Split prism vision alignment rework station from our Evolution series. We call this system the E3Vi For further details on PDR Focused IR rework stations/systems
Events Calendar | Sat Sep 26 18:30:00 UTC 2020 - Wed Sep 30 18:30:00 UTC 2020 | Rosemont, Illinois USA
SMTA International 2020 Conference & Exhibition
Events Calendar | Thu Mar 26 18:30:00 UTC 2020 - Thu Mar 26 18:30:00 UTC 2020 | ,
Optimizing Conformal Coating Coverage for Improved Environmental Corrosion Protection - Free Webinar
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/products/solder-paste?con=t&page=32
. Products Content Your results for: Solder Paste and Flux PICO® Toµch™ Controllers Nordson EFD The PICO Toµch controller’s intuitive touchscreen interface greatly simplifies setup and operation of the PICO Pµlse
FKN Systek | http://fknsystek.com/Step%20Motors.htm
Hot List for Step Motors Step Motors and Controllers from Stogra Rugged Stepper Motors for Harsh Environments Nema sizes 23, 34, and 42 Step accuracy ±3% based on a 1.8
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