Industry News | 2018-10-18 10:16:53.0
Solder Tinned Pads vs Gold Plated Pads - The Importance of Selecting the Proper Surface Finish
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/de-DE/divisions/efd/resource-center/solder-selection-guide
lötbar Kupfer Verzinkter Stahl Gold Kovar Magnesium Nicht lötbar Baustahl Monel Nichrom Nickel Nickel-Eisen/Legierung42 Nickel-Silber Palladium Platin Silber
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/06/Optimizing-Reflowed-Solder-TIM-sTIMs-Processes-for-Emerging-Heterogeneous.pdf
) are similarly used in packages requiring additional reflow cycles. As a contrast to compliant TIMs, gold alloys (for AuSn20, k~57 W/m-K) provide solutions where the bond and alloy are strong enough to deflect the package to absorb thermal strains
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