New Equipment | Solder Materials
V9 No Clean solder paste is formulated for near-zero voiding on BGA, BTC and LED soldering applications. Significant void reduction achievable on all surface finishes including ENIG, ImSn and OSP. V9 exhibits stable print performance on fine feature
New Equipment | Assembly Services
Thick-Copper PCB Material: Fr-4 Layer Count: 4 layers PCB Thickness: 1.4mm Min. Trace / Space Outer: 0.065mm Min. Drilled Hole: 0.2mm Via Process: Tenting Vias Surface Finish: ENIG Product Features Features: 1) Years of experience in half-
Industry News | 2015-04-10 15:53:44.0
Blue Thunder Technologies will offer LOCTITE GC 10, named "The Game Changer"
Industry News | 2024-11-18 19:03:05.0
Stand J90
SMTnet Express, November 10, 2022, Subscribers: 24,925, Companies: 11,649, Users: 27,549 █ Electronics Manufacturing Technical Articles Effect Of Vacuum Reflow On Solder Joint Voiding In Bumped Components Voids affect the thermal
40731 | https://www.smta.org/smtai/SMTAI-2019-Technical-Program.pdf?v=200609010628
Surface Mount Technology Association (SMTA)
