Industry News: enig problems (8)

SMTA International Conference on Soldering and Reliability Program Announced

Industry News | 2011-02-24 20:35:03.0

The SMTA is pleased to announce the program for the 2011 International Conference on Soldering and Reliability being held May 3-6 in Toronto, Ontario, Canada.

Surface Mount Technology Association (SMTA)

IPC Announces Winter 2012 Webinar Schedule

Industry News | 2011-12-21 22:41:39.0

Offering convenient and cost-effective staff development, IPC announces its Winter Webinar Series for January, February and March 2012. The one-hour webinars which focus on critical issues facing the industry, offer companies an opportunity to bring IPC technical information to a large number of employees at one time.

Association Connecting Electronics Industries (IPC)

Technical Library: enig problems (1)

Solving the ENIG Black Pad Problem: An ITRI Report on Round 2

Technical Library | 2013-01-17 15:37:21.0

A problem exists with electroless nickel / immersion gold (ENIG) surface finish on some pads, on some boards, that causes the solder joint to separate from the nickel surface, causing an open. The solder has wet and dissolved the gold. A weak tin to nickel intermetallic bond initially occurs, but the intermetallic bond cracks and separates when put under stress. Since the electroless nickel / immersion gold finish performs satisfactory in most applications, there had to be some area within the current chemistry process window that was satisfactory. The problem has been described as a 'BGA Black Pad Problem' or by HP as an 'Interfacial Fracture of BGA Packages…'[1]. A 24 variable experiment using three different chemistries was conducted during the ITRI (Interconnect Technology Research Institute) ENIG Project, Round 1, to investigate what process parameters of the chemical matrix were potentially satisfactory to use and which process parameters of the chemical matrix need to be avoided. The ITRI ENIG Project has completed Round 1 of testing and is now in the process of Round 2 TV (Test Vehicle) build.

Celestica Corporation

Express Newsletter: enig problems (454)

Partner Websites: enig problems (7)

Beyond the Surface: A Peek into How PCBs Are Made

Imagineering, Inc. | https://www.pcbnet.com/blog/how-pcbs-are-made/

. Small imperfections in copper traces can lead to problems with signal integrity, component compatibility, manufacturability, and functionality

Imagineering, Inc.

Solder Dictionary of Terms | Nordson EFD

ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resources/solder-dictionary-of-terms

& Solutions Nordson produces industrial machinery designed to solve problems in an expansive set of diverse industries. View All Products Bonding

ASYMTEK Products | Nordson Electronics Solutions


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