Industry News: enig problem (8)

SMTA International Conference on Soldering and Reliability Program Announced

Industry News | 2011-02-24 20:35:03.0

The SMTA is pleased to announce the program for the 2011 International Conference on Soldering and Reliability being held May 3-6 in Toronto, Ontario, Canada.

Surface Mount Technology Association (SMTA)

IPC Announces Winter 2012 Webinar Schedule

Industry News | 2011-12-21 22:41:39.0

Offering convenient and cost-effective staff development, IPC announces its Winter Webinar Series for January, February and March 2012. The one-hour webinars which focus on critical issues facing the industry, offer companies an opportunity to bring IPC technical information to a large number of employees at one time.

Association Connecting Electronics Industries (IPC)

Technical Library: enig problem (1)

Solving the ENIG Black Pad Problem: An ITRI Report on Round 2

Technical Library | 2013-01-17 15:37:21.0

A problem exists with electroless nickel / immersion gold (ENIG) surface finish on some pads, on some boards, that causes the solder joint to separate from the nickel surface, causing an open. The solder has wet and dissolved the gold. A weak tin to nickel intermetallic bond initially occurs, but the intermetallic bond cracks and separates when put under stress. Since the electroless nickel / immersion gold finish performs satisfactory in most applications, there had to be some area within the current chemistry process window that was satisfactory. The problem has been described as a 'BGA Black Pad Problem' or by HP as an 'Interfacial Fracture of BGA Packages…'[1]. A 24 variable experiment using three different chemistries was conducted during the ITRI (Interconnect Technology Research Institute) ENIG Project, Round 1, to investigate what process parameters of the chemical matrix were potentially satisfactory to use and which process parameters of the chemical matrix need to be avoided. The ITRI ENIG Project has completed Round 1 of testing and is now in the process of Round 2 TV (Test Vehicle) build.

Celestica Corporation

Express Newsletter: enig problem (454)

Partner Websites: enig problem (6)

The Role of PCB Assembly and Fabrication in the Aerospace Industry

Imagineering, Inc. | https://www.pcbnet.com/blog/the-role-of-pcb-assembly-and-fabrication-in-the-aerospace-industry/

with immersion gold coating (ENIG) and immersion silver. Hot air solder leveling (HASL) is a type of PCB finish that involves dipping the PCB into molten solder, which covers exposed copper surfaces. The PCB is then passed between hot air knives to

Imagineering, Inc.

Webinars and Webtorials

Surface Mount Technology Association (SMTA) | https://www.smta.org/education/presentations/presentations.cfm

. Webinars and Webtorials Listen to outstanding speakers without leaving your desk. No travel budget? No problem. SMTA Webinars and Webtorials are a great solution for getting the latest information on electronics assembly and advanced packaging at the best price

Surface Mount Technology Association (SMTA)


enig problem searches for Companies, Equipment, Machines, Suppliers & Information

Sm t t t t t t t t t t net
  1 2 3 4 5 6 7 8 9 10 Next
PCB Handling with CE

Best Reflow Oven
Voidless Reflow Soldering

Training online, at your facility, or at one of our worldwide training centers"
SMT feeders

Software programs for SMT placement and AOI Inspection machines from CAD or Gerber.
Electronic Solutions R3

BEST IPC Certifications and Solder Training Online!