Industry Directory | Manufacturer
Tough devices for tough environments. Rugged Science offers multiple solutions for any industry with our embedded devices.
Industry Directory | Other / Consultant / Service Provider / Manufacturer
Innov-X Systems specializes in portable and on-site elemental analysis using X-ray Fluorescence (XRF) spectroscopy. A simple solution for RoHS Compliance Screening - simultaneously screen for all five restricted RoHS elements in a
MICROFOCUS X-RAY 3D/CT SYSTEM VX-9100 The VX-9100 3D X-Ray Inspection Machine is a state-of-the-art industrial microfocus CT system designed for precise quality inspection and non-destructive analysis of electronic components. Its advanced cap
I.C.T AI-4026 | Automated PCB Visual Optical AOI Inspection Machine Overview Introduction: DIP Online AOI AI-4026(Before THT Soldering) I.C.T DIP AOI captures board image in real time by high precision color industrial camera. Adopt Convol
Used SMT Equipment | In-Circuit Testers
JDSU FireBerd 8000-CFB8000-02-C2000-V6 Communications Analyzer JDSU FB8000 The FIREBERD 8000 combines the success of two highly successful test platforms - the FIREBERD 6000A and the TestPad. As a datacom analysis module for the TestPad, the por
Used SMT Equipment | In-Circuit Testers
JDSU FireBerd 8000-CFB8000-02-C2000-V6 Communications Analyzer JDSU FB8000 The FIREBERD 8000 combines the success of two highly successful test platforms - the FIREBERD 6000A and the TestPad. As a datacom analysis module for the TestPad, the por
Industry News | 2003-02-13 08:11:45.0
eSight Can Reduce Time-to-manufacture and Time-to-market by as Much as 80%
Industry News | 2003-07-03 08:45:09.0
Leading Electronic Manufacturing Service Provider Leverages Tradec Solution to Manage Commodity Cost and Accelerate the Quotation Process
Technical Library | 2021-08-11 00:57:57.0
This paper shows the Design and Finite Element analysis of vacuum chamber of potting machine designed for electronic ignition coil applications. There are two types of potting methods 1) With Vacuum 2) Without Vacuum.
Technical Library | 2015-02-19 16:54:34.0
Pad cratering is an important failure mode besides crack of solder joint as it’ll pass the regular test but have impact on the long term reliability of the product. A new pin pull test method with solder ball attached and positioning the test board at an angle of 30º is employed to study the strength of pad cratering. This new method clearly reveals the failure mechanism. And a proper way to interpret the finite element analysis (FEA) result is discussed. Impact of pad dimension, width and angle of copper trace on the strength is included. Some findings not included in previous research could help to guide the design for better performance
I.C.T AI-4026 | Automated PCB Visual Optical AOI Inspection Machine Overview Introduction: DIP Online AOI AI-4026(Before THT Soldering) I.C.T DIP AOI captures board image in real time by high precision color industrial camera. Adopt Convol
I.C.T-AI-4540 | Visual Optical System DIP Inverted Camera Online AOI Machines Overview Introduction: DIP Inverted Camera Online AOI AI-4540(After THT Soldering) I.C.T DIP AOI captures board image in real time by high precision color indust
Events Calendar | Mon Apr 05 18:30:00 UTC 2021 - Mon Apr 05 18:30:00 UTC 2021 | ,
Capital Chapter Webinar: Next Gen Lead Free Solders for High Reliability & SMT Yield improvement
Events Calendar | Wed May 12 18:30:00 UTC 2021 - Wed May 12 18:30:00 UTC 2021 | ,
Joint Chapter Meeting: Photonic Soldering
Career Center | San Diego, California USA | Engineering
Kodak - A Design & Product Testing Engineer is responsible for oversight of ink jet printer projects being conducted by the Testing and Customer Assurance area. Oversight includes assurance of the data integrity as well as effective collection, redu
Career Center | South Plainfield, New Jersey USA | Sales/Marketing
MacDermid Alpha Electronics Solutions, an Element Solutions, Inc. business and world leader in the development, manufacturing, and sales of innovative materials used in the assembly electronics, industrial joining and Photo Voltaic market places, is
Career Center | Rochester, New York USA | Engineering,Production,Sales/Marketing,Technical Support
Working Experience: Fairchild Semiconductor, South Portland, ME Package Simulation Co-op: Technology CAD Group (Mar.2002-Present) Thermal simulation for 40 lead fine pitch QSOP & 48 lead one die fine pitch QSOP: Created a 3D model
Career Center | Johnson City, New York USA | Engineering,Research and Development
I am currently pursuing my Master's degree in Mechanical Engineering at the State University of New York at Binghamton, NY and expect to graduate by May 2000. I have been working as a Graduate Research Associate since August 1998, for the CSP/DCA
| http://etasmt.com/cc?ID=te_news_industry,3761&url=_print
. This is usually done through finite element analysis. Solder joint modeling must be performed at different levels to take into consideration all aspects of solder joint reliability
| https://www.eptac.com/faqs/ask-helena-leo/ask/multiple-wash-steps-affecting-resistance-characteristics
. Many reasons could cause this issue, so my suggestion would be to have the component sent to a lab for surface analysis to determine whether or not the problem is contamination or deterioration of the resistive element
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