Industry Directory | Consultant / Service Provider
DownStream is a software company focused on helping engineering organizations automate the PCB Release Process. We offer tools that help optimize, validate and document PCB designs before they are released to manufacturing.
New Equipment | Curing Equipment
Heller 788 In-line, Continuous Cure, Vertical Format Oven This elevator format oven utilizes vertical space to accomodate curing applications of up to 4 hours while only occupying 96" (2.5m) of floorspace. Perfect for underfill and encapsulant.
Retrofit existing system with Innovative Dispensing Technology for Excellent Dispense Control and Repeatability Advanced pump technologies available for retrofitting include: True Volumetric Pump, Precision Auger Pump, Simplified Jetting Pump and Ti
Used SMT Equipment | AOI / Automated Optical Inspection
This machine is available for immediate purchase. Our end-user customer does not have a set price for this item. They have told us to forward them all offers. Please contact ashlin@bajabid.com for more information. Features: YesVis
Used SMT Equipment | AOI / Automated Optical Inspection
Make: Mirtec Model: MV-3L Vintage: 2017 Description: Desktop AOI Details: Operating System: Windows 7 Software Version: 5.5.4.00 Cameras: 5 (1 top down and 4 side) Camera Resolution: All 10MP [Mega Pixel) Other: Inteli-Beam Laser inspection
Industry News | 2013-10-10 09:56:45.0
GPD Global has again pushed the limits for small-volume dispensing with its new Nano-Piston pump. Dots of conductive adhesive down to 100 μm and solder paste for 01005s are possible with the Nano-Piston Pump.
Industry News | 2013-06-10 17:08:51.0
GPD Global will exhibit in Stand #6275 in the North Hall at the 2013 SEMICON West exhibition & conference. Representatives from GPD Global will exhibit the company's new technology related to fine line and nano-shot dispensing, particularly related to vertical interconnect technology.
Technical Library | 2023-01-17 17:50:59.0
Heller's new Condenser Tube Flux Recovery System is designed to provide more efficient flux collection than earlier Heller flux collection systems; while providing minimal down time for inspection and cleaning. The entire system easily fits within the rear of the top shell of an 1800-EXL oven. The system utilizes a different set of top shell caps specially designed to provide the best serviceability of both the flux collection system and maintenance of the heater zone blower motors.
Technical Library | 2023-01-17 17:58:36.0
Heterogeneous integration has become an important performance enabler as high-performance computing (HPC) demands continue to rise. The focus to enable heterogeneous integration scaling is to push interconnect density limit with increased bandwidth and improved power efficiency. Many different advanced packaging architectures have been deployed to increase I/O wire / area density for higher data bandwidth requirements, and to enable more effective die disaggregation. Embedded Multi-die Interconnect Bridge (EMIB) technology is an advanced, cost-effective approach to in-package high density interconnect of heterogeneous chips, providing high density I/O, and controlled electrical interconnect paths between multiple dice in a package. In emerging architectures, it is required to scale down the EMIB die bump pitch in order to further increase the die-to-die (D2D) communication bandwidth. Aa a result, bump pitch scaling poses significant challenges in the plated solder bump reflow process, e.g., bump height / coplanarity control, solder wicking control, and bump void control. It's crucial to ensure a high-quality solder bump reflow process to meet the final product reliability requirements. In this paper, a combined formic acid based fluxless and vacuum assisted reflow process is developed for fine pitch plated solder bumping application. A high-volume production (HVM) ready tool has been developed for this process.
This elevator format oven utilizes vertical space to accomodate curing applications of up to 4 hours while only occupying 96" (2.5m) of floorspace. Perfect for underfill and encapsulant.
http://www.gpd-global.com Tilt-and-Rotate configuration is available. Full featured programming makes conformal coating processes quick and easy. 3-axis Conformal Coating System for printed circuit boards that provides a reliable robotic platform f
Training Courses | | | Other Courses
Other courses related to electronics manufacturing and assembly
Training Courses | | | PCB Design Courses
The PCB design courses teach students the process, techniques and tools needed to design layout of printed circuit boards.
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Wine Down Wednesday: Save the Date
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Wine Down Wednesday: A Texpat Down Under- The Good, the Quirky, & the Utterly Ridiculous
Career Center | Seven Hills, Ohio USA | Engineering,Production
The qualified candidate will be responsible for the operation and progamming of pick and place machines. This will include operating screen printing equipment set-up of reflow and cleaning systems and tear down of said systems. Hand soldering of in
Career Center | Seven Hills, Ohio USA | Engineering,Production
The qualified candidate will be responsible for the operation and progamming of pick and place machines. This will include operating screen printing equipment set-up of reflow and cleaning systems and tear down of said systems. Hand soldering of in
Career Center | chennai, India | Engineering,Maintenance
Nokia India Pvt LTD. Sriperumpudur – Board Assembler Maintenance Technician from Sep 2009 to till now. Machines Handled Pick & Place : FUJI NXT Machines FUJI NXT - M3 II ,M3S. Reflow oven: Hot flow 3/20, 2/14. Stencil Pr
Career Center | Leominster, Massachusetts USA | Engineering,Production
I work as a Debug Technician for 10 years. Skilled in Debug PCB's down to component level and a power to ground short expert.
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/industrial-coating-systems/products/can-manufacturing-induction-dryers-and-heaters/ecodry-compound-dryer
. Open-door interlock switches Over- and under-temperature alarms and shut-downs Integral exhaust blower purges moist air from induction tube Easy installation, all electronics housed in common
Heller Industries Inc. | http://hellerindustries.com/smt-solder-reflow/
. Mini cool coils can be placed in the heat zones for enhanced zone-zone thermal separation, or to achieve fast cool downs for rapid recipe changeovers