Industry News | 2017-01-24 17:10:51.0
At next month’s IPC APEX Expo (APEX) event in San Diego, California, Henkel Adhesive Technologies’ electronics business will display a full range of state-of-the-art electronic materials, all designed to push the conventional limits of performance capability. From February 14 through 16 in booth #1501, Henkel’s line of game-changing solder, encapsulant, underfill and thermal materials will be on show.
Industry News | 2017-03-06 12:24:15.0
Last month at the IPC APEX Expo event in San Diego, California, Henkel’s TECNOMELT AS 8998 hot melt masking material was presented with a Circuits Assembly NPI award in recognition of its ability to meet several criteria, including: creativity and innovation, compatibility with existing technology, cost-effectiveness, design, expected reliability, flexibility, speed/throughput improvements, performance, user-friendliness, and expected maintainability and reparability. The award capped off what has been a successful first year for TECHNOMELT AS 8998, which was commercialized in early 2016 and has already lowered cost and improved operational efficiency at several global electronics manufacturers.
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